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    Monomodal Copolymer of Ethylene for Injection Molding and Process for its Preparation
    1.
    发明申请
    Monomodal Copolymer of Ethylene for Injection Molding and Process for its Preparation 审中-公开
    用于注射成型的乙烯单共聚物及其制备方法

    公开(公告)号：US20100144988A1

    公开(公告)日：2010-06-10

    申请号：US12449082

    申请日：2008-01-15

    Applicant: Klaus Foettinger ,  Manfred Hecker ,  Lothar Berger ,  Rainer Karer ,  Dieter Lilge

    Inventor： Klaus Foettinger ,  Manfred Hecker ,  Lothar Berger ,  Rainer Karer ,  Dieter Lilge

    IPC: C08F210/02 ,  C08F4/22

    CPC classification number: C08F210/16 ,  C08F2/34 ,  C08F4/24 ,  C08F10/14 ,  C08F2500/12 ,  C08F2500/04 ,  C08F2500/11

    Abstract: Monomodal copolymers of ethylene and molding compositions comprising such copolymers, wherein the copolymers have a density determined according to DIN EN ISO 1183-1, variant A in the range from 0.938 to 0.944 g/cm3, a melt index MFR21 determined according to ISO 1133 at 190° C. under a load of 21.6 kg in the range from 12 to 17 g/10 min, a weight average molar mass Mw, in the range from 140 000 g/mol to 330 000 g/mol, a polydispersity Mw/Mn in the range from 9 to 17, and a content of comonomer side chains per 1000 carbon atoms C x equal to or above a value defined via equation (I) Cx=128.7−134.62×d′, wherein d′ is the numerical value of the density of the copolymer in g/cm3, the use of the copolymers for producing injection-molded articles, as well as injection-molded articles comprising the copolymers, and process for the preparation of such monomodal copolymers.

    Abstract translation: 乙烯的单共聚物和包含这种共聚物的模塑组合物，其中共聚物具有根据DIN EN ISO 1183-1，变体A在0.938至0.944g / cm 3范围内测定的密度，根据ISO 1133测定的熔体指数MFR 21 190℃，21.6kg，12-17g / 10min范围内的重均摩尔质量Mw，140,000g / mol〜330000g / mol，多分散性Mw / Mn 在9至17的范围内，每1000个碳原子的共聚单体侧链的含量C x等于或高于通过式（I）定义的值Cx = 128.7-134.62×d'，其中d'是 共聚物的密度（g / cm 3），用于制备注射成型制品的共聚物的使用，以及包含共聚物的注模制品以及制备这种单峰共聚物的方法。

    Method and Device for the Thermal Treatment of Substrates
    2.
    发明申请
    Method and Device for the Thermal Treatment of Substrates 有权
    基板热处理方法和装置

    公开(公告)号：US20080217319A1

    公开(公告)日：2008-09-11

    申请号：US11573012

    申请日：2005-11-12

    Applicant: Werner Saule ,  Lothar Berger ,  Christian Krauss ,  Robert Weihing

    Inventor： Werner Saule ,  Lothar Berger ,  Christian Krauss ,  Robert Weihing

    IPC: H05B3/20 ,  G05B13/02 ,  H01L21/02

    CPC classification number: H01L21/67248 ,  H01L21/67103

    Abstract: This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.

    Abstract translation: 本发明涉及一种用于热处理基板的方法和装置，其中基板被保持与加热板接触或距离加热板稍微距离，该加热板由多个可单独控制的加热元件在 所述加热板至少在其平面中被与所述基板间隔开的框架包围，并且所述加热板以受控方式被包围在所述框架与所述框架的至少一个边缘之间的间隙中 加热板。

    Method and device for the thermal treatment of substrates
    4.
    发明授权
    Method and device for the thermal treatment of substrates 有权
    用于基材热处理的方法和装置

    公开(公告)号：US07842905B2

    公开(公告)日：2010-11-30

    申请号：US11573012

    申请日：2005-11-12

    Applicant: Werner Saule ,  Lothar Berger ,  Christian Krauss ,  Robert Weihing

    Inventor： Werner Saule ,  Lothar Berger ,  Christian Krauss ,  Robert Weihing

    IPC: H05B3/68 ,  A21B2/00 ,  C23C16/00

    CPC classification number: H01L21/67248 ,  H01L21/67103

    Abstract: This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.

    Abstract translation: 本发明涉及一种用于热处理基板的方法和装置，其中基板被保持与加热板接触或距离加热板稍微距离，该加热板由多个可单独控制的加热元件在 所述加热板至少在其平面中被与所述基板间隔开的框架包围，并且所述加热板以受控方式被包围在所述框架与所述框架的至少一个边缘之间的间隙中 加热板。

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