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公开(公告)号:US06858088B1
公开(公告)日:2005-02-22
申请号:US09913986
申请日:2000-01-19
申请人: Peter Dress , Karl Appich , Peter Krauss , Jakob Szekeresch , Robert Weihing
发明人: Peter Dress , Karl Appich , Peter Krauss , Jakob Szekeresch , Robert Weihing
IPC分类号: B05D1/40 , B05C11/08 , B05D3/10 , G03F7/16 , H01L21/00 , H01L21/027 , C23C16/00 , C23F1/00 , H01L21/306
CPC分类号: H01L21/6715 , B05C11/08 , G03F7/162
摘要: To achieve a uniform coating of a substrate, with an apparatus and a method for coating substrates, according to which the substrate is supported on a substrate holder in such a way that a substrate surface that is to be coated is exposed, and the substrate is rotated together with the substrate holder, a cover can be secured to the substrate holder and together with the substrate holder forms a sealed chamber for the substrate.
摘要翻译: 为了实现衬底的均匀涂布,使用用于涂覆衬底的装置和方法,根据该装置和衬底被支撑在衬底保持器上,使得待被涂覆的衬底表面被暴露,并且衬底是 与衬底保持器一起旋转,盖可以固定到衬底保持器并与衬底保持器一起形成用于衬底的密封室。
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公开(公告)号:US20080217319A1
公开(公告)日:2008-09-11
申请号:US11573012
申请日:2005-11-12
申请人: Werner Saule , Lothar Berger , Christian Krauss , Robert Weihing
发明人: Werner Saule , Lothar Berger , Christian Krauss , Robert Weihing
CPC分类号: H01L21/67248 , H01L21/67103
摘要: This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.
摘要翻译: 本发明涉及一种用于热处理基板的方法和装置,其中基板被保持与加热板接触或距离加热板稍微距离,该加热板由多个可单独控制的加热元件在 所述加热板至少在其平面中被与所述基板间隔开的框架包围,并且所述加热板以受控方式被包围在所述框架与所述框架的至少一个边缘之间的间隙中 加热板。
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公开(公告)号:US07842905B2
公开(公告)日:2010-11-30
申请号:US11573012
申请日:2005-11-12
申请人: Werner Saule , Lothar Berger , Christian Krauss , Robert Weihing
发明人: Werner Saule , Lothar Berger , Christian Krauss , Robert Weihing
CPC分类号: H01L21/67248 , H01L21/67103
摘要: This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.
摘要翻译: 本发明涉及一种用于热处理基板的方法和装置,其中基板被保持与加热板接触或距离加热板稍微距离,该加热板由多个可单独控制的加热元件在 所述加热板至少在其平面中被与所述基板间隔开的框架包围,并且所述加热板以受控方式被包围在所述框架与所述框架的至少一个边缘之间的间隙中 加热板。
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公开(公告)号:US06512207B1
公开(公告)日:2003-01-28
申请号:US09914113
申请日:2001-08-23
申请人: Peter Dress , Uwe Dietze , Jakob Szekeresch , Robert Weihing
发明人: Peter Dress , Uwe Dietze , Jakob Szekeresch , Robert Weihing
IPC分类号: F27B514
CPC分类号: H01L21/67248 , H01L21/67103
摘要: A device and method for thermally treating substrates. A substrate is heated by a heating plate to improve thermal homogeneity. The heating plate is heated using a number of separately controlled heating elements. The temperature of the heating elements is measured and the heating process is controlled by a PID controller. In addition, the temperature of the substrate surface facing away from the heating plate is locally measured. The temperature distribution over the substrate surface is determined according to the measured temperatures and set values for the temperature of the individual heating elements are determined and transmitted to the PID controller.
摘要翻译: 一种用于热处理基板的装置和方法。 基板被加热板加热以改善热均匀性。 使用多个单独控制的加热元件来加热加热板。 测量加热元件的温度,加热过程由PID控制器控制。 此外,局部测量背离加热板的基板表面的温度。 根据测量的温度确定衬底表面上的温度分布,并确定各个加热元件的温度的设定值并将其传输到PID控制器。
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