Invention Grant
- Patent Title: RF module package for releasing stress
- Patent Title (中): RF模块封装，用于释放应力
-
Application No.: US11647448Application Date: 2006-12-29
-
Publication No.: US07911044B2Publication Date: 2011-03-22
- Inventor: Wen-Kun Yang , Chun-Hui Yu , Chihwei Lin
- Applicant: Wen-Kun Yang , Chun-Hui Yu , Chihwei Lin
- Applicant Address: TW Hukou Township, Hsinchu County
- Assignee: Advanced Chip Engineering Technology Inc.
- Current Assignee: Advanced Chip Engineering Technology Inc.
- Current Assignee Address: TW Hukou Township, Hsinchu County
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the die; a protection layer formed over the RDL; and pluralities of pads formed on the protection layer and coupled to the RDL. The RDL is made from an alloy comprising Ti/Cu/Au alloy or Ti/Cu/Ni/Au alloy.
Public/Granted literature
- US20080157341A1 RF module package Public/Granted day:2008-07-03
Information query
IPC分类:
