公开(公告)号：US20070007648A1

公开(公告)日：2007-01-11

申请号：US11175420

申请日：2005-07-06

Applicant: Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

Inventor： Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

IPC: H01L23/04

CPC classification number: H01L23/3114 ,  H01L23/16 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/4334 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05567 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.

公开(公告)号：US07911044B2

公开(公告)日：2011-03-22

申请号：US11647448

申请日：2006-12-29

Applicant: Wen-Kun Yang ,  Chun-Hui Yu ,  Chihwei Lin

Inventor： Wen-Kun Yang ,  Chun-Hui Yu ,  Chihwei Lin

IPC: H01L23/02

CPC classification number: H01L23/5389 ,  H01L23/467 ,  H01L23/66 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/24137 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

Abstract: The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the die; a protection layer formed over the RDL; and pluralities of pads formed on the protection layer and coupled to the RDL. The RDL is made from an alloy comprising Ti/Cu/Au alloy or Ti/Cu/Ni/Au alloy.

Abstract translation: 本发明公开了一种包装体的结构，其特征在于，包括：具有模头的通孔的基板; 基底，其附接在所述基底的下表面上; 模具，设置在模具接收通孔内并附接在基座上; 形成在所述管芯和所述基板上的电介质层; 在所述电介质层上形成并耦合到所述管芯的再分布层（RDL）; 形成在RDL上的保护层; 以及形成在保护层上并耦合到RDL的多个焊盘。 RDL由包含Ti / Cu / Au合金或Ti / Cu / Ni / Au合金的合金制成。

公开(公告)号：US20070082428A1

公开(公告)日：2007-04-12

申请号：US11538098

申请日：2006-10-03

Applicant: Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

Inventor： Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

IPC: H01L21/00

CPC classification number: H01L23/3114 ,  H01L23/16 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/4334 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05567 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.

Abstract translation: 本发明提供一种半导体器件保护结构。 该结构包括具有与印刷电路板电耦合的接触金属球的模具。 芯片的背面直接粘接在基板上，在基板上形成第一缓冲层。 衬底配置在第二缓冲层上，使得当衬底的一侧与外部物体相撞时，第二缓冲层基本上包围整个衬底以减小对衬底的损伤。

公开(公告)号：US20080174008A1

公开(公告)日：2008-07-24

申请号：US11624629

申请日：2007-01-18

Applicant: Wen-Kun Yang ,  Chun-Hui Yu ,  Chihwei Lin ,  Chao-nan Chou

Inventor： Wen-Kun Yang ,  Chun-Hui Yu ,  Chihwei Lin ,  Chao-nan Chou

IPC: H01L25/065 ,  H01L21/50

CPC classification number: G11C5/02 ,  G11C5/025 ,  G11C5/063 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/16 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73267 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/013

Abstract: The present invention provides a structure of memory card comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and a through hole structure formed there through, traces formed within the substrate; a first die disposed within the die receiving cavity; a first dielectric layer formed on the first die and the substrate; a first re-distribution layer (RDL) formed on the first dielectric layer, wherein the first RDL is coupled to the first die and the traces; a second dielectric layer formed over the first RDL; a second die disposed on the second dielectric layer; a third dielectric layer formed over the second dielectric layer and the second die; a second RDL formed on the third dielectric layer, wherein the second RDL is coupled to the second die and the first RDL; a forth dielectric layer formed over the second RDL; a third die formed over the forth dielectric layer and coupled to the second RDL; a fifth dielectric layer formed around the third die; and a plastic cover enclosed the first, second and third dice.

Abstract translation: 本发明提供了一种存储卡的结构，该结构包括一个基板，该基板在该基板的上表面内形成有一个模具接收腔，以及一个通孔结构，其形成在该基板内; 设置在所述模具容纳腔内的第一模具; 形成在所述第一管芯和所述基板上的第一电介质层; 形成在所述第一介电层上的第一再分布层（RDL），其中所述第一RDL耦合到所述第一裸片和所述迹线; 形成在所述第一RDL上的第二电介质层; 设置在所述第二电介质层上的第二管芯; 形成在所述第二介电层和所述第二管芯上的第三电介质层; 形成在所述第三介电层上的第二RDL，其中所述第二RDL耦合到所述第二裸片和所述第一RDL; 形成在所述第二RDL上的第四电介质层; 形成在所述第四电介质层上并耦合到所述第二RDL的第三裸片; 形成在第三模具周围的第五电介质层; 和一个塑料盖包围第一，第二和第三个骰子。

公开(公告)号：US07176567B2

公开(公告)日：2007-02-13

申请号：US11175420

申请日：2005-07-06

Applicant: Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

Inventor： Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

IPC: H01L23/04 ,  H01L23/24 ,  H01L23/06

CPC classification number: H01L23/3114 ,  H01L23/16 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/4334 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05567 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.

Abstract translation: 本发明提供一种半导体器件保护结构。 该结构包括具有与印刷电路板电耦合的接触金属球的模具。 芯片的背面直接粘接在基板上，在基板上形成第一缓冲层。 衬底配置在第二缓冲层上，使得当衬底的一侧与外部物体相撞时，第二缓冲层基本上包围整个衬底以减小对衬底的损伤。

公开(公告)号：US07416920B2

公开(公告)日：2008-08-26

申请号：US11538098

申请日：2006-10-03

Applicant: Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

Inventor： Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

IPC: H01L21/44 ,  H01L21/50 ,  H01L21/48

CPC classification number: H01L23/3114 ,  H01L23/16 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/4334 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05567 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.

Abstract translation: 本发明提供一种半导体器件保护结构。 该结构包括具有与印刷电路板电耦合的接触金属球的模具。 芯片的背面直接粘接在基板上，在基板上形成第一缓冲层。 衬底配置在第二缓冲层上，使得当衬底的一侧与外部物体相撞时，第二缓冲层基本上包围整个衬底以减小对衬底的损伤。

公开(公告)号：US20080173792A1

公开(公告)日：2008-07-24

申请号：US11656410

申请日：2007-01-23

Applicant: Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Chihwei Lin ,  Hsien-Wen Hsu

Inventor： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Chihwei Lin ,  Hsien-Wen Hsu

IPC: H01L27/00

CPC classification number: H01L27/14618 ,  H01L24/24 ,  H01L24/82 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19105 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00

Abstract: The present invention provides an image sensor module structure comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate and a die having a micro lens disposed within the die receiving cavity. A dielectric layer is formed on the die and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

Abstract translation: 本发明提供了一种图像传感器模块结构，其包括具有形成在基板的上表面内的模具接收空腔的基板和基板内的导电迹线以及具有设置在模具接收腔内的微透镜的模具。 在管芯和衬底上形成电介质层，在电介质层上形成再分配导电层（RDL），其中RDL耦合到管芯，并且导电迹线和电介质层具有露出 微透镜。 透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。 滤光片安装在透镜和微透镜之间。 该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

公开(公告)号：US20080157341A1

公开(公告)日：2008-07-03

申请号：US11647448

申请日：2006-12-29

Applicant: Wen-Kun Yang ,  Chun-Hui Yu ,  Chihwei Lin

Inventor： Wen-Kun Yang ,  Chun-Hui Yu ,  Chihwei Lin

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L23/5389 ,  H01L23/467 ,  H01L23/66 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/24137 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

Abstract: The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the die; a protection layer formed over the RDL; and pluralities of pads formed on the protection layer and coupled to the RDL. The RDL is made from an alloy comprising Ti/Cu/Au alloy or Ti/Cu/Ni/Au alloy.

Abstract translation: 本发明公开了一种包装体的结构，其特征在于，包括：具有模头的通孔的基板; 基底，其附接在所述基底的下表面上; 模具，设置在模具接收通孔内并附接在基座上; 形成在所述管芯和所述基板上的电介质层; 在所述电介质层上形成并耦合到所述管芯的再分布层（RDL）; 形成在RDL上的保护层; 以及形成在保护层上并耦合到RDL的多个焊盘。 RDL由包含Ti / Cu / Au合金或Ti / Cu / Ni / Au合金的合金制成。