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发明授权
US07915727B2 Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same 有权
用于散热构件的胶带，包括散热构件的薄膜型半导体封装的芯片，以及包括该散热构件的电子设备

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
摘要：
Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
摘要（中）：

公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

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