发明授权
- 专利标题: Semiconductor device and manufacturing method of the same
- 专利标题(中): 半导体器件及其制造方法相同
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申请号: US12912609申请日: 2010-10-26
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公开(公告)号: US07935597B2公开(公告)日: 2011-05-03
- 发明人: Yasuhiro Shimamoto , Digh Hisamoto , Tetsuya Ishimaru , Shinichiro Kimura
- 申请人: Yasuhiro Shimamoto , Digh Hisamoto , Tetsuya Ishimaru , Shinichiro Kimura
- 申请人地址: JP Kawasaki-shi
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kawasaki-shi
- 代理机构: Miles & Stockbridge P.C.
- 优先权: JP2006-212321 20060803
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
Performance and reliability of a semiconductor device including a non-volatile memory are improved. A memory cell of the non-volatile memory includes, over an upper portion of a semiconductor substrate, a select gate electrode formed via a first dielectric film and a memory gate electrode formed via a second dielectric film formed of an ONO multilayered film having a charge storing function. The first dielectric film functions as a gate dielectric film, and includes a third dielectric film made of silicon oxide or silicon oxynitride and a metal-element-containing layer made of a metal oxide or a metal silicate formed between the select gate electrode and the third dielectric film. A semiconductor region positioned under the memory gate electrode and the second dielectric film has a charge density of impurities lower than that of a semiconductor region positioned under the select gate electrode and the first dielectric film.
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