发明授权
- 专利标题： Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet
- 专利标题（中）： 多层片材，其制造方法和使用该多层片材的压敏粘合片材
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申请号： US11358886申请日： 2006-02-21
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公开(公告)号： US07976952B2公开(公告)日： 2011-07-12
- 发明人: Yoshinori Yoshida , Kouji Akazawa , Tomohiro Kontani , Kohei Yano
- 申请人： Yoshinori Yoshida , Kouji Akazawa , Tomohiro Kontani , Kohei Yano
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2005-047504 20050223; JP2005-233266 20050811
- 主分类号： B32B27/32
- IPC分类号： B32B27/32 ; B32B27/36 ; B32B27/40
摘要：
To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.
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