公开(公告)号：US20070054469A1

公开(公告)日：2007-03-08

申请号：US11514454

申请日：2006-09-01

申请人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

发明人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

IPC分类号： H01L21/30

CPC分类号： C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006

摘要： To provide a pressure-sensitive adhesive sheet, which is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet has a base, an intermediate layer and a pressure-sensitive adhesive layer in this order, wherein the intermediate layer has an elastic modulus in tension at 23° C. of 10 MPa or more and 100 Mpa or less, the intermediate layer includes an acrylic-based polymer obtained by polymerization of a mixture containing 70 to 99 parts by weight of a (meth)acrylate monomer and 1 to 30 parts by weight of an unsaturated carboxylic acid based on 100 parts by weight of total monomers, and the base includes at least one film having an elastic modulus in tension at 23° C. of 0.6 GPa or more.

摘要翻译： 为了提供用于加工诸如半导体晶片的物品的压敏粘合片，该压敏粘合片依次具有基底，中间层和压敏粘合剂层，其中中间层 在23℃下的拉伸弹性模量为10MPa以上至100Mpa以下，中间层包含通过聚合含有70〜99重量份的（甲基）丙烯酸酯的混合物而得到的丙烯酸系聚合物 单体和1〜30重量份的不饱和羧酸，基于100重量份的总单体，并且所述基材包括至少一种在23℃下的拉伸弹性模量为0.6GPa以上的膜。

公开(公告)号：US07976952B2

公开(公告)日：2011-07-12

申请号：US11358886

申请日：2006-02-21

申请人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

发明人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

IPC分类号： B32B27/32 ,  B32B27/36 ,  B32B27/40

CPC分类号： H01L21/6836 ,  B32B27/40 ,  C08G18/6208 ,  C08L33/06 ,  C08L2666/04 ,  C09J7/29 ,  C09J175/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/31504 ,  Y10T428/31565 ,  Y10T428/31573

摘要： To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

摘要翻译： 为了提供在加工制品例如半导体晶片和用于这种压敏粘合片的层叠片材中使用的压敏粘合片，其在处理期间不会污染或破坏半导体晶片，并且可以使物品的卷曲最小化 对于压敏粘合片的残余应力，多层片材包括含有聚氨酯聚合物和乙烯基类聚合物作为有效成分的复合膜和由与复合膜不同的材料制成的第一膜，其中 聚氨酯聚合物由聚烯烃二醇和多异氰酸酯形成。 通过在多层片材的至少一面上设置压敏粘合剂层来获得压敏粘合片。

公开(公告)号：US20070071969A1

公开(公告)日：2007-03-29

申请号：US11524177

申请日：2006-09-20

申请人： Tomohiro Kontani ,  Kouji Akazawa ,  Kohei Yano ,  Yoshinori Yoshida

发明人： Tomohiro Kontani ,  Kouji Akazawa ,  Kohei Yano ,  Yoshinori Yoshida

IPC分类号： B32B7/12 ,  B32B15/04

CPC分类号： H01L21/6836 ,  B32B27/40 ,  C08G18/4854 ,  C08G18/6229 ,  C08G18/7642 ,  C08G18/8116 ,  C08G2170/40 ,  C08L33/08 ,  C08L2666/04 ,  C09J7/29 ,  C09J175/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2848

摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer that causes neither contamination nor breakage of the semiconductor wafer during the processing, the pressure-sensitive adhesive sheet has a base, an intermediate layer, and a pressure-sensitive adhesive layer in order. The intermediate layer includes a composite film that contains an acrylic-based polymer and a vinyl-based polymer as active ingredients. The urethane polymer contains a component having a weight-average molecular weight of 10,000 or less in a differential molecular weight curve in a content of less than 10%.

摘要翻译： 为了提供在处理期间用于加工诸如半导体晶片的制品的压敏粘合剂，其不会引起污染或不会破坏半导体晶片，所以压敏粘合片具有基底，中间层和压力 敏感粘合剂层。 中间层包括含有丙烯酸类聚合物和乙烯基类聚合物作为活性成分的复合膜。 氨基甲酸酯聚合物的含量在10％以下的差示分子量曲线中含有重均分子量为10,000以下的成分。

公开(公告)号：US20060188725A1

公开(公告)日：2006-08-24

申请号：US11358886

申请日：2006-02-21

申请人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

发明人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

IPC分类号： B32B37/00

CPC分类号： H01L21/6836 ,  B32B27/40 ,  C08G18/6208 ,  C08L33/06 ,  C08L2666/04 ,  C09J7/29 ,  C09J175/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/31504 ,  Y10T428/31565 ,  Y10T428/31573

摘要： To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

摘要翻译： 为了提供在加工制品例如半导体晶片和用于这种压敏粘合片的层叠片材中使用的压敏粘合片，其在处理期间不会污染或破坏半导体晶片，并且可以使物品的卷曲最小化 对于压敏粘合片的残余应力，多层片材包括含有聚氨酯聚合物和乙烯基类聚合物作为有效成分的复合膜和由与复合膜不同的材料制成的第一膜，其中 聚氨酯聚合物由聚烯烃二醇和多异氰酸酯形成。 通过在多层片材的至少一面上设置压敏粘合剂层来获得压敏粘合片。

公开(公告)号：US20070059903A1

公开(公告)日：2007-03-15

申请号：US11514504

申请日：2006-09-01

申请人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

发明人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

IPC分类号： H01L21/30

CPC分类号： H01L21/6835 ,  B24B37/30 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/003 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23° C. of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylic polymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23° C. of 0.6 GPa or more.

摘要翻译： 为了提供用于加工诸如半导体晶片的物品的压敏粘合剂，压敏粘合片是依次具有基底，中间层和压敏粘合剂层的粘合片，其中中间层 在23℃的伸长率下的弹性模量为1MPa以上至100MPa以下，中间层包含通过聚合含有1重量％以上且20重量％以上的（甲基）丙烯酸单体混合物而得到的丙烯酸类聚合物， 以下的含氮丙烯酸类单体，所述丙烯酸类聚合物含有20重量％以下的分子量为100,000以下的聚合物成分，所述基材包括至少一层在拉伸下具有弹性模量的膜 在23℃下为0.6GPa以上。

公开(公告)号：US20070036930A1

公开(公告)日：2007-02-15

申请号：US11500118

申请日：2006-08-07

申请人： Tomohiro Kontani ,  Yoshinori Yoshida ,  Toshio Shintani ,  Kouji Akazawa

发明人： Tomohiro Kontani ,  Yoshinori Yoshida ,  Toshio Shintani ,  Kouji Akazawa

IPC分类号： B32B33/00

CPC分类号： B32B7/12 ,  B32B7/06 ,  B32B27/08 ,  B32B27/308 ,  B32B2309/105 ,  B32B2405/00 ,  C08L33/08 ,  C08L2666/04 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J133/08 ,  C09J2201/162 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2433/006 ,  Y10T428/14

摘要： To provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N/mm2 or less, a loss tangent (tanδ) at 20° C. to 70° C. of 0.4 or more, and a gel fraction of 30% or more

摘要翻译： 为了提供用于处理晶片等物品的压敏粘合片，即使当凹凸的高度差大时，也可以产生较少的压敏粘合片的切割污泥，并且可以跟随晶片的不均匀性 所述粘合片具有在其一个表面上具有中间层和压敏粘合剂层的基体，其中所述中间层的初始弹性模量为0.5N / mm 2以下， 或更少，在20℃至70℃的损耗角正切（tandelta）为0.4或更大，凝胶分数为30％或更多

公开(公告)号：US20050153129A1

公开(公告)日：2005-07-14

申请号：US11038147

申请日：2005-01-21

申请人： Yoshinori Yoshida ,  Yohei Maeno ,  Kouji Akazawa ,  Takeshi Matsumura ,  Tomokazu Takahashi

发明人： Yoshinori Yoshida ,  Yohei Maeno ,  Kouji Akazawa ,  Takeshi Matsumura ,  Tomokazu Takahashi

IPC分类号： B32B27/08 ,  C09J7/02 ,  H01L21/68 ,  B32B9/00 ,  B32B33/00 ,  B32B7/12 ,  B32B15/04

CPC分类号： B32B27/08 ,  B32B7/12 ,  B32B2307/748 ,  B32B2405/00 ,  C09J7/29 ,  C09J2201/162 ,  C09J2433/006 ,  C09J2475/006 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6839 ,  Y10T428/28 ,  Y10T428/2848

摘要： Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.

摘要翻译： 公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。 为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片，并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲，压敏粘合剂 片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜，包含不同于复合膜的材料的第一膜和压敏粘合剂层。 优选的是，压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量 宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。

公开(公告)号：US20130183759A1

公开(公告)日：2013-07-18

申请号：US13822906

申请日：2011-09-14

申请人： Shinya Yamanaka ,  Yoshinori Yoshida ,  Hidaka Yokota

发明人： Shinya Yamanaka ,  Yoshinori Yoshida ,  Hidaka Yokota

IPC分类号： C12N15/01

CPC分类号： C12N15/00 ,  C12N5/0696 ,  C12N15/01 ,  C12N2501/998

摘要： The present invention provides a method of improving the efficiency of establishment of induced pluripotent stem (iPS) cells by inhibiting p38 function in the step of somatic cell nuclear reprogramming. The p38 function can be inhibited by bringing an inhibitor selected from the group consisting of (1) a chemical inhibitor of p38 (2) a dominant negative mutant of p38 or a nucleic acid that encodes the same, (3) a nucleic acid selected from the group consisting of siRNAs and shRNAs targeted to p38 and DNAs that encode the same and (4) an inhibitor of p38 pathway into contact with a somatic cell and the like. The present invention also provides an agent for improving the efficiency of establishment of induced pluripotent stem cells, which contains an inhibitor of p38 function, particularly an inhibitor selected from the group consisting of (1) a chemical inhibitor of p38 (2) a dominant negative mutant of p38 or a nucleic acid that encodes the same, (3) a nucleic acid selected from the group consisting of siRNAs and shRNAs targeted to p38 and DNAs that encode the same and (4) an inhibitor of p38 pathway. Moreover, the present invention provides a production method of iPS cells, which includes bringing a nuclear reprogramming substance and an inhibitor of p38 function into contact with a somatic cell.

摘要翻译： 本发明提供了通过在体细胞核重编程步骤中抑制p38功能来提高诱导多能干细胞（iPS）细胞建立效率的方法。 可以通过使选自下述的抑制剂来抑制p38的功能：（1）p38的化学抑制剂（2）p38的显性失活突变体或其编码的核酸，（3）选自以下的核酸： 由针对p38的siRNA和shRNA组成的组和编码该p38的DNA和（4）p38途径的抑制剂与体细胞等接触的组。 本发明还提供了用于提高诱导多能干细胞的建立效率的试剂，其含有p38功能的抑制剂，特别是选自（1）p38（2）的显性阴性的化学抑制剂 p38的突变体或编码其的核酸，（3）选自靶向p38的siRNA和shRNA的核酸和编码其的DNA，以及（4）p38途径的抑制剂。 此外，本发明提供了iPS细胞的制备方法，其包括使核重编程物质和p38功能抑制剂与体细胞接触。

公开(公告)号：US20090288763A1

公开(公告)日：2009-11-26

申请号：US12311980

申请日：2007-10-29

申请人： Kazuyuki Kiuchi ,  Yoshinori Yoshida

发明人： Kazuyuki Kiuchi ,  Yoshinori Yoshida

IPC分类号： B32B38/10 ,  B32B3/26

CPC分类号： H01L21/6836 ,  C09J5/06 ,  C09J7/26 ,  C09J7/29 ,  C09J2201/128 ,  C09J2205/302 ,  C09J2400/243 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/6834 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/19041 ,  Y10T428/249953

摘要： A thermally strippable double faced adhesive sheet comprising a substrate, a thermally strippable pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a pressure-sensitive adhesive layer (B) arranged on the other side of the substrate, in which the substrate comprises a porous substrate. The porous substrate preferably has a density of 0.9 g/cm3 or less and a tensile elastic modulus of 20 MPa or less. The substrate may comprise a laminate of the porous substrate and a non-porous substrate. Exemplary usable adhesives for the pressure-sensitive adhesive layer (B) include pressure-sensitive adhesives, ultraviolet-curable pressure-sensitive adhesives, thermally strippable pressure-sensitive adhesives, thermoplastic pressure-sensitive adhesives, and thermosetting pressure-sensitive adhesives.

摘要翻译： 一种可热剥离的双面粘合片，包括基材，布置在基材一侧的可热剥离的压敏粘合剂层（A）和布置在基材的另一侧上的压敏粘合剂层（B）， 其中基底包括多孔基底。 多孔质基材的密度优选为0.9g / cm 3以下，拉伸弹性模量为20MPa以下。 基底可以包括多孔基底和非多孔基底的层压体。 用于粘合剂层（B）的示例性可用粘合剂包括压敏粘合剂，紫外线固化型压敏粘合剂，热剥离压敏粘合剂，热塑性压敏粘合剂和热固性压敏粘合剂。

公开(公告)号：US20080099788A1

公开(公告)日：2008-05-01

申请号：US11933195

申请日：2007-10-31

申请人： Yoshinori Yoshida ,  Tatsuya Tominari ,  Toshio Ando

发明人： Yoshinori Yoshida ,  Tatsuya Tominari ,  Toshio Ando

IPC分类号： H01L29/737 ,  H01L21/331

CPC分类号： H01L29/7378 ,  H01L21/8249 ,  H01L27/0623 ,  H01L29/66242

摘要： The external base electrode has a two-layered structure where a p-type polysilicon film doped with a medium concentration of boron is laminated on a p-type polysilicon film doped with a high concentration of boron. Therefore, since the p-type polysilicon film doped with a high concentration of boron is in contact with an intrinsic base layer at a junction portion between the external base electrode and the intrinsic base layer, the resistance of the junction portion can be reduced. In addition, since the resistance of the external base electrode becomes a parallel resistance of the two layers of the p-type polysilicon films, the resistance of the p-type polysilicon film whose boron concentration is relatively lower is dominant.

摘要翻译： 外部基极具有两层结构，其中掺杂有中等浓度硼的p型多晶硅膜层压在掺杂有高浓度硼的p型多晶硅膜上。 因此，由于掺杂高浓度的硼的p型多晶硅膜在外部基极和本征基极层之间的接合部与本征基极层接触，所以能够降低接合部的电阻。 此外，由于外部基极的电阻成为p型多晶硅膜的两层的并联电阻，所以其硼浓度相对较低的p型多晶硅膜的电阻是主要的。