公开(公告)号：US20070054469A1

公开(公告)日：2007-03-08

申请号：US11514454

申请日：2006-09-01

申请人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

发明人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

IPC分类号： H01L21/30

CPC分类号： C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006

摘要： To provide a pressure-sensitive adhesive sheet, which is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet has a base, an intermediate layer and a pressure-sensitive adhesive layer in this order, wherein the intermediate layer has an elastic modulus in tension at 23° C. of 10 MPa or more and 100 Mpa or less, the intermediate layer includes an acrylic-based polymer obtained by polymerization of a mixture containing 70 to 99 parts by weight of a (meth)acrylate monomer and 1 to 30 parts by weight of an unsaturated carboxylic acid based on 100 parts by weight of total monomers, and the base includes at least one film having an elastic modulus in tension at 23° C. of 0.6 GPa or more.

摘要翻译： 为了提供用于加工诸如半导体晶片的物品的压敏粘合片，该压敏粘合片依次具有基底，中间层和压敏粘合剂层，其中中间层 在23℃下的拉伸弹性模量为10MPa以上至100Mpa以下，中间层包含通过聚合含有70〜99重量份的（甲基）丙烯酸酯的混合物而得到的丙烯酸系聚合物 单体和1〜30重量份的不饱和羧酸，基于100重量份的总单体，并且所述基材包括至少一种在23℃下的拉伸弹性模量为0.6GPa以上的膜。

公开(公告)号：US07976952B2

公开(公告)日：2011-07-12

申请号：US11358886

申请日：2006-02-21

申请人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

发明人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

IPC分类号： B32B27/32 ,  B32B27/36 ,  B32B27/40

CPC分类号： H01L21/6836 ,  B32B27/40 ,  C08G18/6208 ,  C08L33/06 ,  C08L2666/04 ,  C09J7/29 ,  C09J175/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/31504 ,  Y10T428/31565 ,  Y10T428/31573

摘要： To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

摘要翻译： 为了提供在加工制品例如半导体晶片和用于这种压敏粘合片的层叠片材中使用的压敏粘合片，其在处理期间不会污染或破坏半导体晶片，并且可以使物品的卷曲最小化 对于压敏粘合片的残余应力，多层片材包括含有聚氨酯聚合物和乙烯基类聚合物作为有效成分的复合膜和由与复合膜不同的材料制成的第一膜，其中 聚氨酯聚合物由聚烯烃二醇和多异氰酸酯形成。 通过在多层片材的至少一面上设置压敏粘合剂层来获得压敏粘合片。

公开(公告)号：US20060188725A1

公开(公告)日：2006-08-24

申请号：US11358886

申请日：2006-02-21

申请人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

发明人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

IPC分类号： B32B37/00

CPC分类号： H01L21/6836 ,  B32B27/40 ,  C08G18/6208 ,  C08L33/06 ,  C08L2666/04 ,  C09J7/29 ,  C09J175/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/31504 ,  Y10T428/31565 ,  Y10T428/31573

摘要： To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

摘要翻译： 为了提供在加工制品例如半导体晶片和用于这种压敏粘合片的层叠片材中使用的压敏粘合片，其在处理期间不会污染或破坏半导体晶片，并且可以使物品的卷曲最小化 对于压敏粘合片的残余应力，多层片材包括含有聚氨酯聚合物和乙烯基类聚合物作为有效成分的复合膜和由与复合膜不同的材料制成的第一膜，其中 聚氨酯聚合物由聚烯烃二醇和多异氰酸酯形成。 通过在多层片材的至少一面上设置压敏粘合剂层来获得压敏粘合片。

公开(公告)号：US20070071969A1

公开(公告)日：2007-03-29

申请号：US11524177

申请日：2006-09-20

申请人： Tomohiro Kontani ,  Kouji Akazawa ,  Kohei Yano ,  Yoshinori Yoshida

发明人： Tomohiro Kontani ,  Kouji Akazawa ,  Kohei Yano ,  Yoshinori Yoshida

IPC分类号： B32B7/12 ,  B32B15/04

CPC分类号： H01L21/6836 ,  B32B27/40 ,  C08G18/4854 ,  C08G18/6229 ,  C08G18/7642 ,  C08G18/8116 ,  C08G2170/40 ,  C08L33/08 ,  C08L2666/04 ,  C09J7/29 ,  C09J175/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2848

摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer that causes neither contamination nor breakage of the semiconductor wafer during the processing, the pressure-sensitive adhesive sheet has a base, an intermediate layer, and a pressure-sensitive adhesive layer in order. The intermediate layer includes a composite film that contains an acrylic-based polymer and a vinyl-based polymer as active ingredients. The urethane polymer contains a component having a weight-average molecular weight of 10,000 or less in a differential molecular weight curve in a content of less than 10%.

摘要翻译： 为了提供在处理期间用于加工诸如半导体晶片的制品的压敏粘合剂，其不会引起污染或不会破坏半导体晶片，所以压敏粘合片具有基底，中间层和压力 敏感粘合剂层。 中间层包括含有丙烯酸类聚合物和乙烯基类聚合物作为活性成分的复合膜。 氨基甲酸酯聚合物的含量在10％以下的差示分子量曲线中含有重均分子量为10,000以下的成分。

公开(公告)号：US20070059903A1

公开(公告)日：2007-03-15

申请号：US11514504

申请日：2006-09-01

申请人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

发明人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

IPC分类号： H01L21/30

CPC分类号： H01L21/6835 ,  B24B37/30 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/003 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23° C. of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylic polymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23° C. of 0.6 GPa or more.

摘要翻译： 为了提供用于加工诸如半导体晶片的物品的压敏粘合剂，压敏粘合片是依次具有基底，中间层和压敏粘合剂层的粘合片，其中中间层 在23℃的伸长率下的弹性模量为1MPa以上至100MPa以下，中间层包含通过聚合含有1重量％以上且20重量％以上的（甲基）丙烯酸单体混合物而得到的丙烯酸类聚合物， 以下的含氮丙烯酸类单体，所述丙烯酸类聚合物含有20重量％以下的分子量为100,000以下的聚合物成分，所述基材包括至少一层在拉伸下具有弹性模量的膜 在23℃下为0.6GPa以上。

公开(公告)号：US20070036930A1

公开(公告)日：2007-02-15

申请号：US11500118

申请日：2006-08-07

申请人： Tomohiro Kontani ,  Yoshinori Yoshida ,  Toshio Shintani ,  Kouji Akazawa

发明人： Tomohiro Kontani ,  Yoshinori Yoshida ,  Toshio Shintani ,  Kouji Akazawa

IPC分类号： B32B33/00

CPC分类号： B32B7/12 ,  B32B7/06 ,  B32B27/08 ,  B32B27/308 ,  B32B2309/105 ,  B32B2405/00 ,  C08L33/08 ,  C08L2666/04 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J133/08 ,  C09J2201/162 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2433/006 ,  Y10T428/14

摘要： To provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N/mm2 or less, a loss tangent (tanδ) at 20° C. to 70° C. of 0.4 or more, and a gel fraction of 30% or more

摘要翻译： 为了提供用于处理晶片等物品的压敏粘合片，即使当凹凸的高度差大时，也可以产生较少的压敏粘合片的切割污泥，并且可以跟随晶片的不均匀性 所述粘合片具有在其一个表面上具有中间层和压敏粘合剂层的基体，其中所述中间层的初始弹性模量为0.5N / mm 2以下， 或更少，在20℃至70℃的损耗角正切（tandelta）为0.4或更大，凝胶分数为30％或更多

公开(公告)号：US20140017126A1

公开(公告)日：2014-01-16

申请号：US14008375

申请日：2012-02-21

申请人： Tomohiro Kontani

发明人： Tomohiro Kontani

IPC分类号： G01N21/41

CPC分类号： G01N21/41 ,  G01N21/03 ,  G01N21/553 ,  G01N2021/0346 ,  G02B6/1226

摘要： Provided are an SPR sensor cell having very excellent detection sensitivity and an SPR sensor. The SPR sensor cell includes a detection unit and a sample mounting portion adjacent to the detection unit. The detection unit includes an under clad layer, a core layer provided so that at least a part thereof is adjacent to the under clad layer, and a metal layer covering the core layer. The core layer has a refractive index of 1.43 or less and an absorption coefficient of 9.5×10−2 (mm−1) or less.

摘要翻译： 提供具有非常优异的检测灵敏度的SPR传感器单元和SPR传感器。 SPR传感器单元包括与检测单元相邻的检测单元和样品安装部。 检测单元包括下包层，设置成使其至少一部分与下包层相邻的芯层和覆盖芯层的金属层。 芯层的折射率为1.43以下，吸收系数为9.5×10 -2（mm -1）以下。

公开(公告)号：US20110003937A1

公开(公告)日：2011-01-06

申请号：US12918887

申请日：2008-12-02

申请人： Tomohiro Kontani

发明人： Tomohiro Kontani

IPC分类号： C08G73/02

CPC分类号： C08F290/00 ,  A61K47/32 ,  B01J20/26 ,  B01J20/267 ,  C08F8/30 ,  C08F290/065 ,  C08F299/00 ,  C08F2810/20 ,  C08F126/02

摘要： To provide a polymer which selectively adsorbs an acidic water-soluble target substance, a polymer which has a specific recognition site for an acidic water-soluble target substance, a production process thereof, and an acidic water-soluble target substance-adsorbing agent.A polymer which selectively adsorbs at least one kind of an acidic water-soluble target substance, in which the polymer has a cross-linked structure formed through a two-step reaction including a Michael addition reaction of a polymer having an amino group and/or imino group with an unsaturated carbonyl cross-linker, and a subsequent radical polymerization.

摘要翻译： 提供选择性吸附酸性水溶性目标物质的聚合物，对酸性水溶性目标物质具有特定识别位点的聚合物，其制备方法和酸性水溶性目标物质吸附剂。 选择性吸附至少一种酸性水溶性目标物质的聚合物，其中该聚合物具有通过包括具有氨基的聚合物的迈克尔加成反应的两步反应形成的交联结构和/或 亚氨基与不饱和羰基交联剂，以及随后的自由基聚合。

公开(公告)号：US08718420B2

公开(公告)日：2014-05-06

申请号：US13702855

申请日：2011-06-02

申请人： Tomohiro Kontani

发明人： Tomohiro Kontani

IPC分类号： G02B6/00

CPC分类号： G02B6/036 ,  G01N21/553 ,  G01N2201/08 ,  G01N2201/0846

摘要： An SPR sensor cell is an SPR sensor cell including an optical waveguide to be brought into contact with a sample. The optical waveguide includes an under clad layer, a core layer provided in the under clad layer such that at least a part thereof is exposed from the under clad layer, and a metal particle layer covering the core layer exposed from the under clad layer to be brought into contact with the sample.

摘要翻译： SPR传感器单元是包括要与样品接触的光波导的SPR传感器单元。 光波导包括下包层，芯层层，其设置在下包层中，使得其至少一部分从下包层暴露，并且覆盖从下包层暴露的芯层的金属颗粒层为 与样品接触。

公开(公告)号：US08362173B2

公开(公告)日：2013-01-29

申请号：US12918887

申请日：2008-12-02

申请人： Tomohiro Kontani

发明人： Tomohiro Kontani

IPC分类号： C08F20/60 ,  C08F20/34

CPC分类号： C08F290/00 ,  A61K47/32 ,  B01J20/26 ,  B01J20/267 ,  C08F8/30 ,  C08F290/065 ,  C08F299/00 ,  C08F2810/20 ,  C08F126/02

摘要： To provide a polymer which selectively adsorbs an acidic water-soluble target substance, a polymer which has a specific recognition site for an acidic water-soluble target substance, a production process thereof, and an acidic water-soluble target substance-adsorbing agent.A polymer which selectively adsorbs at least one kind of an acidic water-soluble target substance, in which the polymer has a cross-linked structure formed through a two-step reaction including a Michael addition reaction of a polymer having an amino group and/or imino group with an unsaturated carbonyl cross-linker, and a subsequent radical polymerization.

摘要翻译： 提供选择性吸附酸性水溶性目标物质的聚合物，对酸性水溶性目标物质具有特定识别位点的聚合物，其制备方法和酸性水溶性目标物质吸附剂。 选择性吸附至少一种酸性水溶性目标物质的聚合物，其中该聚合物具有通过包括具有氨基的聚合物的迈克尔加成反应的两步反应形成的交联结构和/或 亚氨基与不饱和羰基交联剂，以及随后的自由基聚合。