- 专利标题： Process of forming ultra thin wafers having an edge support ring
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申请号： US11880455申请日： 2007-07-20
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公开(公告)号： US08048775B2公开(公告)日： 2011-11-01
- 发明人: Tao Feng , Sung-Shan Tai
- 申请人： Tao Feng , Sung-Shan Tai
- 申请人地址： US CA Sunnyvale
- 专利权人： Alpha and Omega Semiconductor Incorporated
- 当前专利权人： Alpha and Omega Semiconductor Incorporated
- 当前专利权人地址： US CA Sunnyvale
- 代理机构： Schein & Cai LLP
- 代理商 Jingming Cai
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/46
摘要：
A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes.