Invention Grant
- Patent Title: Thermally zoned substrate holder assembly
- Patent Title (中): 热分区衬底支架组件
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Application No.: US11961355Application Date: 2007-12-20
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Publication No.: US08092602B2Publication Date: 2012-01-10
- Inventor: Steven T. Fink , Eric J. Strang
- Applicant: Steven T. Fink , Eric J. Strang
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/46
Abstract:
A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature control elements. The insulator is made from an insulting material having a lower coefficient of thermal conductivity than the base (e.g., a gas- or vacuum-filled chamber).
Public/Granted literature
- US07850782B2 Thermally zoned substrate holder assembly Public/Granted day:2010-12-14
Information query
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