发明授权
- 专利标题： Control of electrolyte composition in a copper electroplating apparatus
- 专利标题（中）： 铜电镀设备中电解质组成的控制
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申请号： US11590413申请日： 2006-10-30
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公开(公告)号： US08128791B1公开(公告)日： 2012-03-06
- 发明人: Bryan Buckalew , Jonathan Reid , John Sukamto , Zhian He , Seshasayee Varadarajan , Steven T. Mayer
- 申请人： Bryan Buckalew , Jonathan Reid , John Sukamto , Zhian He , Seshasayee Varadarajan , Steven T. Mayer
- 申请人地址： US CA San Jose
- 专利权人： Novellus Systems, Inc.
- 当前专利权人： Novellus Systems, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Weaver Austin Villeneuve & Sampson LLP
- 主分类号： C25D21/14
- IPC分类号： C25D21/14 ; C25D3/38
摘要：
In a copper electroplating apparatus having separate anolyte and catholyte portions, the concentration of anolyte components (e.g., acid or copper salt) is controlled by providing a diluent to the recirculating anolyte. The dosing of the diluent can be controlled by the user and can follow a pre-determined schedule. For example, the schedule may specify the diluent dosing parameters, so as to prevent precipitation of copper salt in the anolyte. Thus, precipitation-induced anode passivation can be minimized.