发明授权
- 专利标题： Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board
- 专利标题（中）： 制造装置的基板的方法和制造印刷电路板的方法
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申请号： US12435185申请日： 2009-05-04
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公开(公告)号： US08146243B2公开(公告)日： 2012-04-03
- 发明人: Hiroshi Asami , Ken Orui , Hidetoshi Kusano , Fumito Hiwatashi
- 申请人： Hiroshi Asami , Ken Orui , Hidetoshi Kusano , Fumito Hiwatashi
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Rockey, Depke & Lyons, LLC
- 代理商 Robert J. Depke
- 优先权： JP2002-223846 20020731
- 主分类号： H05K3/20
- IPC分类号： H05K3/20 ; H05K3/34 ; H05K3/46
摘要：
A method of manufacturing a device-incorporated substrate as well as a printed circuit board. A transfer sheet is formed having a structure that includes two layers, a metal base material and a dissolvee metal layer and a conductor pattern is formed on the dissolvee metal layer by electroplating. After the transfer sheet on which the conductor pattern is formed is adhered onto an insulating base material, the transfer sheet is removed by separating the metal base material from the dissolvee metal layer and thereafter selectively dissolving and removing the dissolvee metal layer with respect to the conductor pattern.
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