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1.发明授权公开(公告)号：US08146243B2
公开(公告)日：2012-04-03
申请号：US12435185
申请日：2009-05-04
申请人： Hiroshi Asami , Ken Orui , Hidetoshi Kusano , Fumito Hiwatashi
发明人： Hiroshi Asami , Ken Orui , Hidetoshi Kusano , Fumito Hiwatashi
CPC分类号： H05K1/187 , H01L21/6835 , H01L23/3128 , H01L23/3157 , H01L23/49816 , H01L24/10 , H01L24/13 , H01L24/24 , H01L24/81 , H01L24/97 , H01L25/105 , H01L2221/68345 , H01L2221/68377 , H01L2224/13 , H01L2224/13111 , H01L2224/13144 , H01L2224/16237 , H01L2224/24227 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K3/205 , H05K3/386 , H05K3/4614 , H05K3/4617 , H05K2201/0394 , H05K2201/10674 , H05K2203/063 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method of manufacturing a device-incorporated substrate as well as a printed circuit board. A transfer sheet is formed having a structure that includes two layers, a metal base material and a dissolvee metal layer and a conductor pattern is formed on the dissolvee metal layer by electroplating. After the transfer sheet on which the conductor pattern is formed is adhered onto an insulating base material, the transfer sheet is removed by separating the metal base material from the dissolvee metal layer and thereafter selectively dissolving and removing the dissolvee metal layer with respect to the conductor pattern.
摘要翻译： 一种制造装置的衬底以及印刷电路板的方法。 形成具有包括两层的结构的转印片，金属基材和溶解金属层，并且通过电镀在溶解金属层上形成导体图案。 在其上形成有导体图案的转印片粘附到绝缘基材上之后，通过将金属基材与溶解金属层分离，然后相对于导体选择性地溶解和除去溶解金属层来去除转印片 模式。
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2.发明申请Method for manufacturing board with built-in device and board with built-in device and method for manufacturing printed wiring board and printed wiring board 有权具有内置装置的板的制造方法和用于制造印刷线路板和印刷线路板的内置装置和方法公开(公告)号：US20060124345A1
公开(公告)日：2006-06-15
申请号：US10523331
申请日：2003-06-20
申请人： Hiroshi Asami , Orui Ken , Kusano Hidetoshi , Fumito Hiwatashi
发明人： Hiroshi Asami , Orui Ken , Kusano Hidetoshi , Fumito Hiwatashi
CPC分类号： H05K1/187 , H01L21/6835 , H01L23/3128 , H01L23/3157 , H01L23/49816 , H01L24/10 , H01L24/13 , H01L24/24 , H01L24/81 , H01L24/97 , H01L25/105 , H01L2221/68345 , H01L2221/68377 , H01L2224/13 , H01L2224/13111 , H01L2224/13144 , H01L2224/16237 , H01L2224/24227 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K3/205 , H05K3/386 , H05K3/4614 , H05K3/4617 , H05K2201/0394 , H05K2201/10674 , H05K2203/063 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet (61) has a structure that includes two layers, a metal base material (62) and a dissolvee metal layer (64), and a conductor pattern (55) is formed on the dissolvee metal layer (64) through electroplating. Then, after the transfer sheet (61) on which the conductor pattern (55) is formed is adhered onto an insulating base material (51), the transfer sheet (61) is removed through a step of separating the metal base material (62) from the dissolvee metal layer (64), and a step of selectively dissolving and removing the dissolvee metal layer (64) with respect to the conductor pattern (55).
摘要翻译： 一种基于器件的衬底和一种制造器件结合衬底的方法，以及印刷电路板和制造印刷电路板的方法，其中可以在绝缘层上以高精度形成精细间距导体图案 同时确保导体图案的尺寸稳定性。 转印片（61）具有包括金属基材（62）和溶解金属层（64）的两层的结构，并且通过电镀在溶解金属层（64）上形成导体图案（55）。 然后，在其上形成有导体图案（55）的转印片（61）粘附到绝缘基材（51）上之后，通过分离金属基材（62）的步骤去除转印片（61） 从所述溶解金属层（64）和相对于所述导体图案（55）选择性地溶解和除去所述溶解金属层（64）的步骤。
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3.发明申请公开(公告)号：US20090217518A1
公开(公告)日：2009-09-03
申请号：US12435185
申请日：2009-05-04
申请人： Asami Hiroshi , Orui Ken , Kusano Hidetoshi , Fumito Hiwatashi
发明人： Asami Hiroshi , Orui Ken , Kusano Hidetoshi , Fumito Hiwatashi
CPC分类号： H05K1/187 , H01L21/6835 , H01L23/3128 , H01L23/3157 , H01L23/49816 , H01L24/10 , H01L24/13 , H01L24/24 , H01L24/81 , H01L24/97 , H01L25/105 , H01L2221/68345 , H01L2221/68377 , H01L2224/13 , H01L2224/13111 , H01L2224/13144 , H01L2224/16237 , H01L2224/24227 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K3/205 , H05K3/386 , H05K3/4614 , H05K3/4617 , H05K2201/0394 , H05K2201/10674 , H05K2203/063 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet (61) has a structure that includes two layers, a metal base material (62) and a dissolvee metal layer (64), and a conductor pattern (55) is formed on the dissolvee metal layer (64) through electroplating. Then, after the transfer sheet (61) on which the conductor pattern (55) is formed is adhered onto an insulating base material (51), the transfer sheet (61) is removed through a step of separating the metal base material (62) from the dissolvee metal layer (64), and a step of selectively dissolving and removing the dissolvee metal layer (64) with respect to the conductor pattern (55).
摘要翻译： 一种基于器件的衬底和一种制造器件结合衬底的方法，以及印刷电路板和制造印刷电路板的方法，其中可以在绝缘层上以高精度形成精细间距导体图案 同时确保导体图案的尺寸稳定性。 转印片（61）具有包括金属基材（62）和溶解金属层（64）的两层的结构，并且通过电镀在溶解金属层（64）上形成导体图案（55）。 然后，在其上形成有导体图案（55）的转印片（61）粘附到绝缘基材（51）上之后，通过分离金属基材（62）的步骤去除转印片（61） 从所述溶解金属层（64）和相对于所述导体图案（55）选择性地溶解和除去所述溶解金属层（64）的步骤。
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公开(公告)号：US07874066B2
公开(公告)日：2011-01-25
申请号：US10523331
申请日：2003-06-20
申请人： Asami Hiroshi , Orui Ken , Kusano Hidetoshi , Fumito Hiwatashi
发明人： Asami Hiroshi , Orui Ken , Kusano Hidetoshi , Fumito Hiwatashi
CPC分类号： H05K1/187 , H01L21/6835 , H01L23/3128 , H01L23/3157 , H01L23/49816 , H01L24/10 , H01L24/13 , H01L24/24 , H01L24/81 , H01L24/97 , H01L25/105 , H01L2221/68345 , H01L2221/68377 , H01L2224/13 , H01L2224/13111 , H01L2224/13144 , H01L2224/16237 , H01L2224/24227 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K3/205 , H05K3/386 , H05K3/4614 , H05K3/4617 , H05K2201/0394 , H05K2201/10674 , H05K2203/063 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet (61) has a structure that includes two layers, a metal base material (62) and a dissolvee metal layer (64), and a conductor pattern (55) is formed on the dissolvee metal layer (64) through electroplating. Then, after the transfer sheet (61) on which the conductor pattern (55) is formed is adhered onto an insulating base material (51), the transfer sheet (61) is removed through a step of separating the metal base material (62) from the dissolvee metal layer (64), and a step of selectively dissolving and removing the dissolvee metal layer (64) with respect to the conductor pattern (55).
摘要翻译： 一种基于器件的衬底和一种制造器件结合衬底的方法，以及印刷电路板和制造印刷电路板的方法，其中可以在绝缘层上以高精度形成精细间距导体图案 同时确保导体图案的尺寸稳定性。 转印片（61）具有包括金属基材（62）和溶解金属层（64）的两层的结构，并且通过电镀在溶解金属层（64）上形成导体图案（55）。 然后，在其上形成有导体图案（55）的转印片（61）粘附到绝缘基材（51）上之后，通过分离金属基材（62）的步骤去除转印片（61） 从所述溶解金属层（64）和相对于所述导体图案（55）选择性地溶解和除去所述溶解金属层（64）的步骤。
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