Invention Grant
US08183696B2 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
有权
封装的半导体器件，包括密封剂嵌入半导体芯片，包括接触焊盘
- Patent Title: Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
- Patent Title (中): 封装的半导体器件，包括密封剂嵌入半导体芯片，包括接触焊盘
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Application No.: US12750946Application Date: 2010-03-31
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Publication No.: US08183696B2Publication Date: 2012-05-22
- Inventor: Thorsten Meyer , Rainer Leuschner , Gerald Ofner , Reinhard Hess , Recai Sezi
- Applicant: Thorsten Meyer , Rainer Leuschner , Gerald Ofner , Reinhard Hess , Recai Sezi
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/78 ; H01L23/488 ; H01L21/98
Abstract:
A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the semiconductor package and second contact pads on a second main face of the semiconductor package opposite to the first main face. The diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, wherein x is the pitch of the second contact pads in micrometers.
Public/Granted literature
- US20110241218A1 Electronic Device and Manufacturing Method Public/Granted day:2011-10-06
Information query
IPC分类:
