发明授权
- 专利标题： Heat conductive sheet and method for producing same, and powder module
- 专利标题（中）： 导热片及其制造方法和粉末组件
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申请号： US12675549申请日： 2008-09-12
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公开(公告)号： US08193633B2公开(公告)日： 2012-06-05
- 发明人: Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
- 申请人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Electric Corporation
- 当前专利权人： Mitsubishi Electric Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2007-248927 20070926; JP2007-248936 20070926
- 国际申请： PCT/JP2008/066551 WO 20080912
- 国际公布： WO2009/041300 WO 20090402
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/10
摘要：
Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.
公开/授权文献
- US20100226095A1 HEAT CONDUCTIVE SHEET AND POWER MODULE 公开/授权日：2010-09-09
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