公开(公告)号：US20100226095A1

公开(公告)日：2010-09-09

申请号：US12675549

申请日：2008-09-12

申请人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

发明人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

IPC分类号： H05K7/20 ,  F28F7/00 ,  B21D53/02

CPC分类号： H01L23/3737 ,  F28F2013/006 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01019 ,  H01L2924/181 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

摘要翻译： 提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有 大于20体积％的二次聚集粒子各自具有50μm以上的粒径。 导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

公开(公告)号：US08236666B2

公开(公告)日：2012-08-07

申请号：US12664751

申请日：2007-12-05

申请人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Takashi Nishimura ,  Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Nobutake Taniguchi ,  Hiroshi Yoshida

发明人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Takashi Nishimura ,  Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Nobutake Taniguchi ,  Hiroshi Yoshida

IPC分类号： H01L21/00 ,  H01L21/46 ,  H01L21/30

CPC分类号： H01L23/3737 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/5386 ,  H01L23/562 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/19107 ,  H05K1/056 ,  H05K3/041 ,  H05K3/202 ,  H05K3/44 ,  H05K2201/0209 ,  H05K2201/09745 ,  H05K2201/09881 ,  H01L2924/00014

摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.

摘要翻译： 提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。 该半导体器件的绝缘性和可靠性优异。

公开(公告)号：US20100201002A1

公开(公告)日：2010-08-12

申请号：US12664751

申请日：2007-12-05

申请人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Takashi Nishimura ,  Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Nobutake Taniguchi ,  Hiroshi Yoshida

发明人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Takashi Nishimura ,  Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Nobutake Taniguchi ,  Hiroshi Yoshida

IPC分类号： H01L23/36 ,  H01L21/58 ,  H01L23/31

CPC分类号： H01L23/3737 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/5386 ,  H01L23/562 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/19107 ,  H05K1/056 ,  H05K3/041 ,  H05K3/202 ,  H05K3/44 ,  H05K2201/0209 ,  H05K2201/09745 ,  H05K2201/09881 ,  H01L2924/00014

摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.

摘要翻译： 提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。 该半导体器件的绝缘性和可靠性优异。

公开(公告)号：US07514782B2

公开(公告)日：2009-04-07

申请号：US11697094

申请日：2007-04-05

申请人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Hiromi Ito

发明人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Hiromi Ito

IPC分类号： H01L23/373

CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L23/3731 ,  H01L25/0655 ,  H01L2023/4081 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the semiconductor device occurring due to heat generation of a semiconductor chip or to varying of the usage environment is also suppressed. The semiconductor device is provided that includes a thermal-conductive sheet 3 formed on a base board 4, including thermal-conductive resin 6, a heat sink 2 provided on the base board 4 through the thermal-conductive sheet 3, a semiconductor chip 1 mounted on the heat sink 2, and a ceramic-embedded region 31 selectively provided in a region of the thermal-conductive sheet 3 under the semiconductor chip 1, including a ceramic component 5. In this semiconductor device, superior thermal conductivity can be ensured, and warpage and peeling in the semiconductor device occurring due to heat generation of the semiconductor chip or to varying of the usage environment can also be reduced.

摘要翻译： 目的是提供一种可靠性改善的半导体器件，其中散热特性优异，并且还抑制了由于半导体芯片的发热而产生的半导体器件的翘曲或者使用环境的变化。 该半导体装置具备：包括导热性树脂6的基板4上形成的导热片3，通过导热片3设置在基板4上的散热片2，安装有半导体芯片1 并且在包含陶瓷部件5的半导体芯片1的下方的热传导片3的区域中选择性地设置陶瓷嵌入区域31.在该半导体装置中，可以确保优良的导热性， 也可以减少由于半导体芯片的发热而发生的半导体器件的翘曲和剥离或使用环境的变化。

公开(公告)号：US08193633B2

公开(公告)日：2012-06-05

申请号：US12675549

申请日：2008-09-12

申请人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

发明人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

IPC分类号： H01L23/34 ,  H01L23/10

CPC分类号： H01L23/3737 ,  F28F2013/006 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01019 ,  H01L2924/181 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

摘要翻译： 提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有 大于20体积％的二次聚集粒子各自具有50μm以上的粒径。 导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

公开(公告)号：US20070241450A1

公开(公告)日：2007-10-18

申请号：US11697094

申请日：2007-04-05

申请人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Hiromi Ito

发明人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Hiromi Ito

IPC分类号： H01L23/34

CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L23/3731 ,  H01L25/0655 ,  H01L2023/4081 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the semiconductor device occurring due to heat generation of a semiconductor chip or to varying of the usage environment is also suppressed. The semiconductor device is provided that includes a thermal-conductive sheet 3 formed on a base board 4, including thermal-conductive resin 6, a heat sink 2 provided on the base board 4 through the thermal-conductive sheet 3, a semiconductor chip 1 mounted on the heat sink 2, and a ceramic-embedded region 31 selectively provided in a region of the thermal-conductive sheet 3 under the semiconductor chip 1, including a ceramic component 5. In this semiconductor device, superior thermal conductivity can be ensured, and warpage and peeling in the semiconductor device occurring due to heat generation of the semiconductor chip or to varying of the usage environment can also be reduced.

摘要翻译： 目的是提供一种可靠性改善的半导体器件，其中散热特性优异，并且还抑制了由于半导体芯片的发热而产生的半导体器件的翘曲或者使用环境的变化。 该半导体装置具备：包括导热性树脂6的基板4上形成的导热片3，通过导热片3设置在基板4上的散热片2，安装有半导体芯片1 以及选择性地设置在包含陶瓷部件5的半导体芯片1的导热性片3的区域内的陶瓷嵌入区域31。 在该半导体装置中，可以确保优异的导热性，并且还可以降低由于半导体芯片的发热而产生的半导体器件的翘曲和剥离或者使用环境的变化。

公开(公告)号：US06984473B2

公开(公告)日：2006-01-10

申请号：US10217466

申请日：2002-08-14

申请人： Teruhiko Kumada ,  Atsuko Fujino ,  Kazuyuki Maetoko

发明人： Teruhiko Kumada ,  Atsuko Fujino ,  Kazuyuki Maetoko

IPC分类号： G03F1/00 ,  G03C5/00

CPC分类号： G03F7/11

摘要： A light-block film is formed on a substrate, and a chemically amplified resist film is then formed on the light-block film. The chemically amplified resist film includes a photosensitive acid generator which generates an acid upon irradiation with activating light or radiation, and mainly contains a first resin that becomes soluble in bases by action of the acid. Next, a protective film is formed on the chemically amplified resist film and thereby yields a mask blank. The protective film is formed by dissolving a second resin and the photosensitive acid generator in a solvent that does not substantially dissolve the chemically amplified resist film to prepare a solution, and applying the solution to the chemically amplified resist film.

摘要翻译： 在基板上形成光阻挡膜，然后在光阻挡膜上形成化学放大抗蚀剂膜。 化学放大抗蚀剂膜包括在用活化光或辐射照射时产生酸的光敏酸产生剂，并且主要含有通过酸的作用变得可溶于碱的第一种树脂。 接着，在化学放大抗蚀剂膜上形成保护膜，由此形成掩模毛坯。 通过将第二树脂和感光酸产生剂溶解在基本上不溶解化学放大抗蚀剂膜以制备溶液的溶剂中并将溶液施加到化学放大抗蚀剂膜上而形成保护膜。

公开(公告)号：US06511792B2

公开(公告)日：2003-01-28

申请号：US09793578

申请日：2001-02-27

申请人： Atsuko Fujino ,  Teruhiko Kumada ,  Atsushi Oshida ,  Koji Tange ,  Hitoshi Fukuma

发明人： Atsuko Fujino ,  Teruhiko Kumada ,  Atsushi Oshida ,  Koji Tange ,  Hitoshi Fukuma

IPC分类号： G03F742

CPC分类号： G03F7/325

摘要： By using a developer consisting essentially of one organic solvent selected from the group consisting of a ketone having 3 to 8 carbon atoms, a carboxylate ester having 3 to 8 carbon atoms, which may have an alkoxy group, and a dicarboxylate ester having 3 to 8 carbon atoms for developing a positive-type radiation resist containing a copolymer of an &agr;-methyl styrene compound and an &agr;-chloroacrylate ester compound as a base resin, there is provided a developing process and a process for forming a pattern (according to GHOST method in particular) which are used for preparing an excellent resist pattern profile, a process for preparing a photomask and a process for preparing a semiconductor device.

摘要翻译： 通过使用主要由选自具有3至8个碳原子的一种有机溶剂，可以具有烷氧基的碳原子数为3至8的羧酸酯和具有3至8个碳原子的二羧酸酯组成的显影剂 用于形成包含α-甲基苯乙烯化合物和α-氯代丙烯酸酯化合物的共聚物作为基础树脂的正型辐射抗蚀剂的碳原子提供了显影方法和形成图案的方法（根据GHOST方法 特别是用于制备优异的抗蚀剂图形轮廓的方法，制备光掩模的方法和制备半导体器件的方法。