Invention Grant
US08207567B2 Metal-oxide-metal structure with improved capacitive coupling area
有权
具有改善电容耦合面积的金属氧化物 - 金属结构
- Patent Title: Metal-oxide-metal structure with improved capacitive coupling area
- Patent Title (中): 具有改善电容耦合面积的金属氧化物 - 金属结构
-
Application No.: US12274255Application Date: 2008-11-19
-
Publication No.: US08207567B2Publication Date: 2012-06-26
- Inventor: Chao-Chi Chin , Ming-Chu King , Chen Cheng Chou
- Applicant: Chao-Chi Chin , Ming-Chu King , Chen Cheng Chou
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L29/92
- IPC: H01L29/92

Abstract:
A stacked metal-oxide-metal (MOM) capacitor structure and method of forming the same to increase an electrode/capacitor dielectric coupling area to increase a capacitance, the MOM capacitor structure including a plurality of metallization layers in stacked relationship; wherein each metallization layer includes substantially parallel spaced apart conductive electrode line portions having a first intervening capacitor dielectric; and, wherein the conductive electrode line portions are electrically interconnected between metallization layers by conductive damascene line portions formed in a second capacitor dielectric and disposed underlying the conductive electrode line portions.
Public/Granted literature
- US20100123214A1 METAL-OXIDE-METAL STRUCTURE WITH IMPROVED CAPACITIVE COUPLING AREA Public/Granted day:2010-05-20
Information query
IPC分类: