Invention Grant
US08222089B2 Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
有权
用于散热构件的胶带，包括散热构件的薄膜型半导体封装的芯片，以及包括该散热构件的电子设备
- Patent Title: Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
- Patent Title (中): 用于散热构件的胶带，包括散热构件的薄膜型半导体封装的芯片，以及包括该散热构件的电子设备
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Application No.: US13033307Application Date: 2011-02-23
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Publication No.: US08222089B2Publication Date: 2012-07-17
- Inventor: Kyoung-sei Choi , Byung-seo Kim , Young-jae Joo , Ye-chung Chung , Kyong-soon Cho , Sang-heui Lee , Si-hoon Lee , Sa-yoon Kang , Dae-woo Son , Sang-gui Jo , Jeong-kyu Ha , Young-sang Cho
- Applicant: Kyoung-sei Choi , Byung-seo Kim , Young-jae Joo , Ye-chung Chung , Kyong-soon Cho , Sang-heui Lee , Si-hoon Lee , Sa-yoon Kang , Dae-woo Son , Sang-gui Jo , Jeong-kyu Ha , Young-sang Cho
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2008-0035821 20080417; KR10-2008-0088469 20080908; KR10-2008-0095518 20080929
- Main IPC: H01J9/00
- IPC: H01J9/00
Abstract:
Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
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