Invention Grant
- Patent Title: System to improve coreless package connections
- Patent Title (中): 系统改进无芯包连接
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Application No.: US12642806Application Date: 2009-12-19
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Publication No.: US08222739B2Publication Date: 2012-07-17
- Inventor: Paul M. Harvey , Colm B. O'Reilly , Samuel W. Yang , Yaping Zhou
- Applicant: Paul M. Harvey , Colm B. O'Reilly , Samuel W. Yang , Yaping Zhou
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Ido Tuchman; Matthew Talpis
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; B23K31/02
Abstract:
A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.
Public/Granted literature
- US20110147044A1 SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS Public/Granted day:2011-06-23
Information query
IPC分类:
