发明授权
US08258410B2 Construction of reliable stacked via in electronic substrates—vertical stiffness control method
有权
在电子基板中构建可靠的堆叠通孔 - 垂直刚度控制方法
- 专利标题： Construction of reliable stacked via in electronic substrates—vertical stiffness control method
- 专利标题（中）： 在电子基板中构建可靠的堆叠通孔 - 垂直刚度控制方法
-
申请号： US12020534申请日： 2008-01-26
-
公开(公告)号： US08258410B2公开(公告)日： 2012-09-04
- 发明人: Karan Kacker , Douglas O. Powell , David L. Questad , David J. Russell , Sri M. Sri-Jayantha
- 申请人： Karan Kacker , Douglas O. Powell , David L. Questad , David J. Russell , Sri M. Sri-Jayantha
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Michael J. Buchenhorner; Vazken Alexanian
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/09
摘要：
A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes a compliant center zone; and spring-like stiffness-reducing connectors for connecting the compliant center zone of the platted through hole landing.
公开/授权文献
信息查询
