发明授权
- 专利标题: High voltage diode with reduced substrate injection
- 专利标题(中): 具有降低衬底注入的高压二极管
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申请号: US13409689申请日: 2012-03-01
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公开(公告)号: US08309423B2公开(公告)日: 2012-11-13
- 发明人: Sameer P. Pendharkar , Binghua Hu
- 申请人: Sameer P. Pendharkar , Binghua Hu
- 申请人地址: US TX Dallas
- 专利权人: Texas Instruments Incorporated
- 当前专利权人: Texas Instruments Incorporated
- 当前专利权人地址: US TX Dallas
- 代理商 Jacqueline J. Garner; Wade J. Brady, III; Frederick J. Telecky Jr.
- 主分类号: H01L29/861
- IPC分类号: H01L29/861
摘要:
A high voltage diode in which the n-type cathode is surrounded by an uncontacted heavily doped n-type ring to reflect injected holes back into the cathode region for recombination or collection is disclosed. The dopant density in the heavily doped n-type ring is preferably 100 to 10,000 times the dopant density in the cathode. The heavily doped n-type region will typically connect to an n-type buried layer under the cathode. The heavily doped n-type ring is optimally positioned at least one hole diffusion length from cathode contacts. The disclosed high voltage diode may be integrated into an integrated circuit without adding process steps.
公开/授权文献
- US20120164814A1 HIGH VOLTAGE DIODE WITH REDUCED SUBSTRATE INJECTION 公开/授权日:2012-06-28
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