公开(公告)号：US20140001596A1

公开(公告)日：2014-01-02

申请号：US13540542

申请日：2012-07-02

申请人： Binghua Hu ,  Sameer Pendharkar ,  Guru Mathur ,  Tamura Takehito

发明人： Binghua Hu ,  Sameer Pendharkar ,  Guru Mathur ,  Tamura Takehito

IPC分类号： H01L29/06 ,  H01L21/762

CPC分类号： H01L21/76224 ,  H01L21/02109 ,  H01L21/265 ,  H01L21/283 ,  H01L21/32055 ,  H01L21/76232 ,  H01L29/0619

摘要： The width of a heavily-doped sinker is substantially reduced by forming the heavily-doped sinker to lie in between a number of closely-spaced trench isolation structures, which have been formed in a semiconductor material. During drive-in, the closely-spaced trench isolation structures significantly limit the lateral diffusion.

摘要翻译： 通过形成重掺杂沉降片位于已形成于半导体材料中的多个紧密间隔的沟槽隔离结构之间，大大减小了重掺杂沉降片的宽度。 在进入期间，紧密间隔的沟槽隔离结构显着限制了横向扩散。

公开(公告)号：US08497565B2

公开(公告)日：2013-07-30

申请号：US13043066

申请日：2011-03-08

申请人： Byron Lovell Willaims ,  Maxwell Walthour Lippitt, III ,  Betty Mercer ,  Scott Montgomery ,  Binghua Hu

发明人： Byron Lovell Willaims ,  Maxwell Walthour Lippitt, III ,  Betty Mercer ,  Scott Montgomery ,  Binghua Hu

IPC分类号： H01L21/02

CPC分类号： H01L28/91

摘要： In a disclosed embodiment, a stacked capacitor (100) has bottom, middle and top metal electrode layers (141A, 141B, 141C) interleaved with dielectric layers (142A, 142B) conformally disposed within holes (140A, 140B, 140C) in a protective overcoat or backend dielectric layer (110) over a top metal layer (115) of an integrated circuit (105). A top electrode (155) contacts the top metal electrode layer (141C). A bottom electrode (150) electrically couples an isolated part of the top metal electrode layer (141C) through a bottom electrode via (165A) to a first contact node (135A) in the top metal layer (115) which is in contact with the bottom metal electrode layer (141A). A middle electrode (160) electrically couples a part of the middle metal electrode layer (141B) not covered by the top metal layer (115) through a middle electrode via (165B) to a second contact node (135B) in the top metal electrode layer (115). The sidewalls of the top and middle electrode vias (165A, 165B) are lined with insulating material to electrically isolate the metal electrode layer ends.

摘要翻译： 在公开的实施例中，叠层电容器（100）具有与保护性地设置在保护孔（140A，140B，140C）内的电介质层（142A，142B）交错的底部，中间和顶部金属电极层（141A，141B，141C） 外部涂层或后端电介质层（110）覆盖在集成电路（105）的顶部金属层（115）上。 顶部电极（155）接触顶部金属电极层（141C）。 底部电极（150）通过（165A）将顶部金属电极层（141C）的隔离部分电耦合到顶部金属层（115）中与第一接触节点（135A）接触的第一接触节点（135A） 底部金属电极层（141A）。 中间电极（160）将未被顶部金属层（115）覆盖的中间金属电极层（141B）的一部分通过中间电极（165B）电耦合到顶部金属电极中的第二接触节点（135B） 层（115）。 顶部和中间电极通孔（165A，165B）的侧壁衬有绝缘材料以电绝缘金属电极层端部。

公开(公告)号：US08264038B2

公开(公告)日：2012-09-11

申请号：US12537326

申请日：2009-08-07

申请人： Sameer P. Pendharkar ,  Binghua Hu ,  Xinfen Chen

发明人： Sameer P. Pendharkar ,  Binghua Hu ,  Xinfen Chen

IPC分类号： H01L29/06 ,  H01L29/78 ,  H01L29/73 ,  H01L27/092 ,  H01L21/761

CPC分类号： H01L21/761 ,  H01L21/823892 ,  H01L29/0623 ,  H01L29/0653 ,  H01L29/086 ,  H01L29/1083 ,  H01L29/1087 ,  H01L29/1095 ,  H01L29/7322 ,  H01L29/7816 ,  H01L29/7833

摘要： A buried layer architecture which includes a floating buried layer structure adjacent to a high voltage buried layer connected to a deep well of the same conductivity type for components in an IC is disclosed. The floating buried layer structure surrounds the high voltage buried layer and extends a depletion region of the buried layer to reduce a peak electric field at lateral edges of the buried layer. When the size and spacing of the floating buried layer structure are optimized, the well connected to the buried layer may be biased to 100 volts without breakdown. Adding a second floating buried layer structure surrounding the first floating buried layer structure allows operation of the buried layer up to 140 volts. The buried layer architecture with the floating buried layer structure may be incorporated into a DEPMOS transistor, an LDMOS transistor, a buried collector npn bipolar transistor and an isolated CMOS circuit.

摘要翻译： 公开了一种掩埋层结构，其包括与连接到IC中的组件的相同导电类型的深阱连接的高电压埋层相邻的浮置掩埋层结构。 浮置掩埋层结构围绕高压掩埋层并且延伸埋层的耗尽区以减小掩埋层的侧边缘处的峰值电场。 当浮动掩埋层结构的尺寸和间距被优化时，连接到掩埋层的阱可被偏压到100伏而不会破坏。 添加围绕第一浮动掩埋层结构的第二浮动掩埋层结构允许埋入层的操作高达140伏。 具有浮动掩埋层结构的掩埋层结构可以并入DEPMOS晶体管，LDMOS晶体管，埋地集电极npn双极晶体管和隔离CMOS电路中。

公开(公告)号：US08253193B2

公开(公告)日：2012-08-28

申请号：US13006566

申请日：2011-01-14

申请人： Marie Denison ,  Sameer Pendharkar ,  Binghua Hu ,  Taylor Rice Efland ,  Sridhar Seetharaman

发明人： Marie Denison ,  Sameer Pendharkar ,  Binghua Hu ,  Taylor Rice Efland ,  Sridhar Seetharaman

IPC分类号： H01L29/66

CPC分类号： H01L29/7825 ,  H01L29/0653 ,  H01L29/0696 ,  H01L29/086 ,  H01L29/0865 ,  H01L29/0869 ,  H01L29/0878 ,  H01L29/42368 ,  H01L29/42376 ,  H01L29/4238 ,  H01L29/66689 ,  H01L29/66704

摘要： An integrated circuit containing an MOS transistor with a trenched gate abutting an isolation dielectric layer over a drift region. The body well and source diffused region overlap the bottom surface of the gate trench. An integrated circuit containing an MOS transistor with a first trenched gate abutting an isolation dielectric layer over a drift region, and a second trenched gate located over a heavily doped buried layer. The buried layer is the same conductivity type as the drift region. A process of forming an integrated circuit containing an MOS transistor, which includes an isolation dielectric layer over a drift region of a drain of the transistor, and a gate formed in a gate trench which abuts the isolation dielectric layer. The gate trench is formed by removing substrate material adjacent to the isolation dielectric layer.

公开(公告)号：US20110156209A1

公开(公告)日：2011-06-30

申请号：US13043066

申请日：2011-03-08

申请人： Byron Lovell Williams ,  Maxwell Walthour Lippitt, III ,  Betty Mercer ,  Scott Montgomery ,  Binghua Hu

发明人： Byron Lovell Williams ,  Maxwell Walthour Lippitt, III ,  Betty Mercer ,  Scott Montgomery ,  Binghua Hu

IPC分类号： H01L29/92

CPC分类号： H01L28/91

摘要： In a disclosed embodiment, a stacked capacitor (100) has bottom, middle and top metal electrode layers (141A, 141B, 141C) interleaved with dielectric layers (142A, 142B) conformally disposed within holes (140A, 140B, 140C) in a protective overcoat or backend dielectric layer (110) over a top metal layer (115) of an integrated circuit (105). A top electrode (155) contacts the top metal electrode layer (141C). A bottom electrode (150) electrically couples an isolated part of the top metal electrode layer (141C) through a bottom electrode via (165A) to a first contact node (135A) in the top metal layer (115) which is in contact with the bottom metal electrode layer (141A). A middle electrode (160) electrically couples a part of the middle metal electrode layer (141B) not covered by the top metal layer (115) through a middle electrode via (165B) to a second contact node (135B) in the top metal electrode layer (115). The sidewalls of the top and middle electrode vias (165A, 165B) are lined with insulating material to electrically isolate the metal electrode layer ends.

摘要翻译： 在公开的实施例中，叠层电容器（100）具有与保护性地设置在保护孔（140A，140B，140C）内的电介质层（142A，142B）交错的底部，中间和顶部金属电极层（141A，141B，141C） 外部涂层或后端电介质层（110）覆盖在集成电路（105）的顶部金属层（115）上。 顶部电极（155）接触顶部金属电极层（141C）。 底部电极（150）通过（165A）将顶部金属电极层（141C）的隔离部分电耦合到顶部金属层（115）中与第一接触节点（135A）接触的第一接触节点（135A） 底部金属电极层（141A）。 中间电极（160）将未被顶部金属层（115）覆盖的中间金属电极层（141B）的一部分通过中间电极（165B）电耦合到顶部金属电极中的第二接触节点（135B） 层（115）。 顶部和中间电极通孔（165A，165B）的侧壁衬有绝缘材料以电绝缘金属电极层端部。

公开(公告)号：US20090294841A1

公开(公告)日：2009-12-03

申请号：US12509922

申请日：2009-07-27

申请人： Sameer Pendharkar ,  Binghua Hu

发明人： Sameer Pendharkar ,  Binghua Hu

IPC分类号： H01L29/78

CPC分类号： H01L29/66712 ,  H01L21/26513 ,  H01L21/26586 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/086 ,  H01L29/1083 ,  H01L29/1095 ,  H01L29/66681 ,  H01L29/7809 ,  H01L29/7816

摘要： A LDMOS transistor having a channel region located between an outer boundary of an n-type region and an inner boundary of a p-body region. A width of the LDMOS channel region is less than 80% of a distance between an outer boundary of an n+-type region and the inner boundary of a p-body region. Also, a method for making a LDMOS transistor where the n-type dopants are implanted at an angle that is greater than an angle used to implant the p-type dopants. Furthermore, a VDMOS having first and second channel regions located between an inner boundary of a first and second p-body region and an outer boundary of an n-type region of the first and second p-body regions. The width of the first and second channel regions of the VDMOS is less than 80% of a distance between the inner boundary of the first and second p-body regions and an outer boundary of an n+-type region of the first and second p-body regions. Moreover, a method for making a VDMOS transistor where the n-type dopants are implanted at an angle that is greater than an angle used to implant the p-type dopants.

摘要翻译： 一种LDMOS晶体管，其具有位于n型区域的外边界和p体区域的内边界之间的沟道区域。 LDMOS通道区域的宽度小于n +型区域的外边界与p体区域的内边界之间的距离的80％。 此外，制造LDMOS晶体管的方法，其中n型掺杂剂以大于用于注入p型掺杂剂的角度的角度注入。 此外，VDMOS具有位于第一和第二p体区域的内边界和第一和第二p体区域的n型区域的外边界之间的第一和第二沟道区域。 VDMOS的第一和第二沟道区域的宽度小于第一和第二p体区域的内边界与第一和第二p体区域的n +型区域的外边界之间的距离的80％ 身体区域。 此外，制造VDMOS晶体管的方法，其中n型掺杂剂以大于用于注入p型掺杂剂的角度的角度注入。

公开(公告)号：US20090200637A1

公开(公告)日：2009-08-13

申请号：US12029798

申请日：2008-02-12

申请人： Byron Lovell Williams ,  Maxwell Walthour Lippitt, III ,  Betty Mercer ,  Scott Montgomery ,  Binghua Hu

发明人： Byron Lovell Williams ,  Maxwell Walthour Lippitt, III ,  Betty Mercer ,  Scott Montgomery ,  Binghua Hu

IPC分类号： H01L29/92 ,  H01L21/02

CPC分类号： H01L28/91

摘要： An embodiment generally relates a method of forming capacitors. The method includes forming a plurality of holes within a protective overcoat or backend dielectric layer of an integrated circuit and depositing multiple layers of metal, each layer of metal electrically tied to an associated electrode. The method also includes alternately depositing multiple layers of dielectric between the multiple layers of metal and coupling a bottom layer of the multiple layers of metal to a contact node in a top metal layer of the integrated circuit.

摘要翻译： 实施例通常涉及形成电容器的方法。 该方法包括在集成电路的保护外涂层或后端电介质层内形成多个孔，并沉积多层金属，每层金属电连接到相关电极。 该方法还包括交替地在多层金属之间沉积多层电介质，并将多层金属的底层耦合到集成电路的顶层金属层中的接触节点。

公开(公告)号：US20080293206A1

公开(公告)日：2008-11-27

申请号：US11753789

申请日：2007-05-25

申请人： Binghua Hu ,  Sameer P. Pendharkar ,  Bill A. Wofford ,  Qingfeng Wang

发明人： Binghua Hu ,  Sameer P. Pendharkar ,  Bill A. Wofford ,  Qingfeng Wang

IPC分类号： H01L21/336

CPC分类号： H01L21/26513 ,  H01L21/26586 ,  H01L29/0653 ,  H01L29/1095 ,  H01L29/42368 ,  H01L29/66681 ,  H01L29/7816

摘要： Exemplary embodiments provide manufacturing methods for forming a doped region in a semiconductor. Specifically, the doped region can be formed by multiple ion implantation processes using a patterned photoresist (PR) layer as a mask. The patterned PR layer can be formed using a hard-bakeless photolithography process by removing a hard-bake step to improve the profile of the patterned PR layer. The multiple ion implantation processes can be performed in a sequence of, implanting a first dopant species using a high energy; implanting the first dopant species using a reduced energy and an increased implant angle (e.g., about 90 or higher); and implanting a second dopant species using a reduced energy. In various embodiments, the doped region can be used as a double diffused region for LDMOS transistors.

摘要翻译： 示例性实施例提供了用于在半导体中形成掺杂区域的制造方法。 具体地，可以通过使用图案化光致抗蚀剂（PR）层作为掩模的多个离子注入工艺来形成掺杂区域。 可以通过去除硬烘烤步骤以改善图案化PR层的轮廓，使用硬烘焙光刻工艺来形成图案化的PR层。 多个离子注入工艺可以以下列顺序执行：使用高能量注入第一掺杂物种; 使用减少的能量和增加的植入角度（例如，约90或更高）注入第一掺杂物种类; 以及使用减少的能量注入第二掺杂剂物质。 在各种实施例中，掺杂区域可以用作LDMOS晶体管的双扩散区域。

公开(公告)号：US20080248062A1

公开(公告)日：2008-10-09

申请号：US12074783

申请日：2008-03-06

申请人： Janine T. Bryan ,  Michelle K. Brownlow ,  Li Shi ,  Danilo Casimiro ,  William L. McClements ,  Brian K. Meyer ,  Binghua Hu

发明人： Janine T. Bryan ,  Michelle K. Brownlow ,  Li Shi ,  Danilo Casimiro ,  William L. McClements ,  Brian K. Meyer ,  Binghua Hu

IPC分类号： A61K39/12 ,  A61P31/12

CPC分类号： A61K39/12 ,  A61K2039/5258 ,  A61K2039/55505 ,  A61K2039/55577 ,  A61K2039/70 ,  C12N7/00 ,  C12N2710/20023 ,  C12N2710/20034

摘要： The present invention relates to pharmaceutical compositions comprising virus-like particles (VLPs) of HPV, said VLPs adsorbed to an aluminum adjuvant, and an ISCOM-type adjuvant comprising a saponin, cholesterol, and a phospholipid. In preferred embodiments, the aluminum adjuvant comprises amorphous aluminum hydroxyphosphate sulfate. Another aspect of the invention provides multi-dose HPV vaccine formulations comprising HPV VLPs and an antimicrobial preservative selected from the group consisting of: m-cresol, phenol and benzyl alcohol. Also provided are methods of using the disclosed pharmaceutical compositions and formulations to induce an immune response against HPV in a human patient and to prevent HPV infection.

摘要翻译： 本发明涉及包含HPV病毒样颗粒（VLP），所述VLP吸附于铝佐剂的IS​​MA型佐剂和包含皂角苷，胆固醇和磷脂的ISCOM型佐剂的药物组合物。 在优选的实施方案中，铝佐剂包括无定形的羟基磷酸氢铝硫酸盐。 本发明的另一方面提供了包含HPV VLP和选自间甲酚，苯酚和苄醇的抗微生物防腐剂的多剂量HPV疫苗制剂。 还提供了使用所公开的药物组合物和制剂在人类患者中诱导针对HPV的免疫应答并防止HPV感染的方法。

公开(公告)号：US07141455B2

公开(公告)日：2006-11-28

申请号：US10712455

申请日：2003-11-12

申请人： Binghua Hu ,  Howard S. Lee ,  Henry L. Edwards ,  John Lin ,  Vladimir N. Bolkhovsky

发明人： Binghua Hu ,  Howard S. Lee ,  Henry L. Edwards ,  John Lin ,  Vladimir N. Bolkhovsky

IPC分类号： H01L21/332

CPC分类号： H01L21/266 ,  H01L21/2652 ,  H01L29/1095 ,  H01L29/42368 ,  H01L29/66681 ,  H01L29/7816

摘要： A double diffused region (65), (75), (85) is formed in an epitaxial layer (20). The double diffused region is formed by first implanting light implant specie such as boron through an opening in a photoresist layer prior to a hard bake process. Subsequent to a hard bake process heavy implant specie such as arsenic can be implanted into the epitaxial layer. During subsequent processing such as LOCOS formation the double diffused region is formed. A dielectric layer (120) is formed on the epitaxial layer (20) and gate structures (130), (135) are formed over the dielectric layer (120).

摘要翻译： 在外延层（20）中形成双扩散区域（65），（75），（85）。 通过在硬烘烤过程之前首先将诸如硼的光注入物质在光致抗蚀剂层中的开口注入，形成双扩散区域。 在硬烘烤过程之后，可以将诸如砷的重植入物种植入外延层中。 在后续处理（如LOCOS形成）中形成双扩散区。 在外延层（20）上形成介电层（120），并且在电介质层（120）之上形成栅极结构（130），（135）。