Invention Grant
- Patent Title: Integrated circuits and manufacturing methods thereof
- Patent Title (中): 集成电路及其制造方法
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Application No.: US12787966Application Date: 2010-05-26
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Publication No.: US08362573B2Publication Date: 2013-01-29
- Inventor: Chung-Cheng Wu , Ali Keshavarzi , Ka Hing Fung , Ta-Pen Guo , Jiann-Tyng Tzeng , Yen-Ming Chen , Shyue-Shyh Lin , Shyh-Wei Wang , Sheng-Jier Yang , Hsiang-Jen Tseng , David B. Scott , Min Cao
- Applicant: Chung-Cheng Wu , Ali Keshavarzi , Ka Hing Fung , Ta-Pen Guo , Jiann-Tyng Tzeng , Yen-Ming Chen , Shyue-Shyh Lin , Shyh-Wei Wang , Sheng-Jier Yang , Hsiang-Jen Tseng , David B. Scott , Min Cao
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is spaced from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. The first metallic layer is electrically coupled with the first source region. The first metallic layer and the first diffusion area overlap with a first distance. A second metallic layer is electrically coupled with the first drain region and the second drain region. The second metallic layer and the first diffusion area overlap with a second distance. The first distance is larger than the second distance.
Public/Granted literature
- US20110291197A1 INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREOF Public/Granted day:2011-12-01
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