Invention Grant
- Patent Title: Inkjet ink composition
- Patent Title (中): 喷墨油墨组合物
-
Application No.: US12636378Application Date: 2009-12-11
-
Publication No.: US08389601B2Publication Date: 2013-03-05
- Inventor: Tae-Hoon Kim , Dong-Hoon Kim , Byung-Ho Jun , Joon-Rak Choi , Young-Kwan Seo , Young-Il Lee
- Applicant: Tae-Hoon Kim , Dong-Hoon Kim , Byung-Ho Jun , Joon-Rak Choi , Young-Kwan Seo , Young-Il Lee
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2009-0075719 20090817
- Main IPC: B01F17/00
- IPC: B01F17/00 ; B32B7/12 ; B32B27/28 ; B41J2/01 ; B41J2/17 ; B41J2/175 ; B60C1/00 ; C07F9/90 ; C08G63/60 ; C08J3/00 ; C08K3/08 ; C08K5/00 ; C08K5/01 ; C08K5/09 ; C08K5/10 ; C08K5/16 ; C08L9/00 ; C08L67/00 ; C08L73/00 ; C08L79/00 ; C09D1/00 ; C09D4/00 ; C09D5/00 ; C09D11/00 ; C09K3/00 ; G01D11/00 ; H01B3/44
Abstract:
The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.
Public/Granted literature
- US20110040014A1 INKJET INK COMPOSITION Public/Granted day:2011-02-17
Information query
