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公开(公告)号：US08389601B2
公开(公告)日：2013-03-05
申请号：US12636378
申请日：2009-12-11
申请人： Tae-Hoon Kim , Dong-Hoon Kim , Byung-Ho Jun , Joon-Rak Choi , Young-Kwan Seo , Young-Il Lee
发明人： Tae-Hoon Kim , Dong-Hoon Kim , Byung-Ho Jun , Joon-Rak Choi , Young-Kwan Seo , Young-Il Lee
IPC分类号： B01F17/00 , B32B7/12 , B32B27/28 , B41J2/01 , B41J2/17 , B41J2/175 , B60C1/00 , C07F9/90 , C08G63/60 , C08J3/00 , C08K3/08 , C08K5/00 , C08K5/01 , C08K5/09 , C08K5/10 , C08K5/16 , C08L9/00 , C08L67/00 , C08L73/00 , C08L79/00 , C09D1/00 , C09D4/00 , C09D5/00 , C09D11/00 , C09K3/00 , G01D11/00 , H01B3/44
摘要： The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.
摘要翻译： 本发明提供一种用于喷墨的金属油墨组合物，更具体地说，一种在PCB基板上不产生裂纹的金属油墨组合物，可以实现低固化温度，并且即使在涂布之后也提供改善的粘合强度。
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公开(公告)号：US20110040014A1
公开(公告)日：2011-02-17
申请号：US12636378
申请日：2009-12-11
申请人： Tae-Hoon Kim , Dong-Hoon Kim , Byung-Ho Jun , Joon-Rak Choi , Young-Kwan Seo , Young-Il Lee
发明人： Tae-Hoon Kim , Dong-Hoon Kim , Byung-Ho Jun , Joon-Rak Choi , Young-Kwan Seo , Young-Il Lee
IPC分类号： C08K3/08
摘要： The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.
摘要翻译： 本发明提供一种用于喷墨的金属油墨组合物，更具体地说，一种在PCB基板上不产生裂纹的金属油墨组合物，可以实现低固化温度，并且即使在涂布之后也提供改善的粘合强度。
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公开(公告)号：US07935169B2
公开(公告)日：2011-05-03
申请号：US12149709
申请日：2008-05-07
申请人： Young-Il Lee , Jae-Woo Joung , Byung-Ho Jun , Joon-Rak Choi , Kwi-Jong Lee
发明人： Young-Il Lee , Jae-Woo Joung , Byung-Ho Jun , Joon-Rak Choi , Kwi-Jong Lee
IPC分类号： B22F9/24
CPC分类号： B22F9/24 , B22F2998/00 , Y10S977/896 , B22F1/0018 , B22F3/003
摘要： The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.
摘要翻译： 本发明涉及一种制造金属纳米颗粒的装置和方法，更具体地涉及一种装置，包括：提供金属纳米颗粒的前体溶液的前体供应部分; 与前体供给部连接的第一加热部包括直径为1〜50mm的反应器通道，并被加热到不产生任何粒子的温度范围; 与第一加热部连接的第二加热部包括直径为1〜50mm的反应器通道，并被加热到制造粒子的温度范围; 以及冷却器，其与第二加热部件连接并且收集和冷却在第二加热部件处产生的金属纳米颗粒，其允许连续大量生产金属纳米颗粒。
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公开(公告)号：US20080282537A1
公开(公告)日：2008-11-20
申请号：US12149892
申请日：2008-05-09
申请人： Kwi-Jong Lee , Young-Il Lee , Byung-Ho Jun , Joon-Rak Choi , In-Keun Shim
发明人： Kwi-Jong Lee , Young-Il Lee , Byung-Ho Jun , Joon-Rak Choi , In-Keun Shim
IPC分类号： H01K3/22
CPC分类号： H05K3/1283 , H05K1/0373 , H05K3/125 , H05K2201/0209 , H05K2201/0257 , H05K2203/013 , H05K2203/101 , H05K2203/1131 , Y10T29/49155 , Y10T29/49163
摘要： The present invention relates to a method for forming a wiring of a printed circuit board and more particularly, to a method including: preparing a base film; forming a wiring pattern with ink including metal nanoparticles on the base film by printing; and forming a wring by the induction heating of the base film on which the wiring pattern is formed. The method of the present invention which minimizes the thermal strain and thermal decomposition of a base film, provides an appropriate sintering process of wirings, shortens the manufacturing process, and exhibits excellent mechanical strength is provided by using the induction heating.
摘要翻译： 本发明涉及一种印刷电路板的布线形成方法，特别是涉及一种制备基膜的方法。 通过印刷在基膜上形成具有包含金属纳米颗粒的油墨的布线图案; 并且通过对其上形成有布线图案的基膜进行感应加热而形成绞合。 本发明的使基膜的热应变和热分解最小化的方法提供了适当的布线烧结工艺，缩短了制造工艺，并且通过使用感应加热提供了优异的机械强度。
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公开(公告)号：US20100319489A1
公开(公告)日：2010-12-23
申请号：US12850276
申请日：2010-08-04
申请人： Young-Il LEE , Jae-Woo Joung , Byung-Ho Jun , Joon-Rak Choi , Kwi-Jong Lee
发明人： Young-Il LEE , Jae-Woo Joung , Byung-Ho Jun , Joon-Rak Choi , Kwi-Jong Lee
IPC分类号： B22F9/16
CPC分类号： B22F9/24 , B22F2998/00 , Y10S977/896 , B22F1/0018 , B22F3/003
摘要： The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.
摘要翻译： 本发明涉及一种制造金属纳米颗粒的装置和方法，更具体地涉及一种装置，包括：提供金属纳米颗粒的前体溶液的前体供应部分; 与前体供给部连接的第一加热部包括直径为1〜50mm的反应器通道，并被加热到不产生任何粒子的温度范围; 与第一加热部连接的第二加热部包括直径为1〜50mm的反应器通道，并被加热到制造粒子的温度范围; 以及冷却器，其与第二加热部件连接并且收集和冷却在第二加热部件处产生的金属纳米颗粒，其允许连续大量生产金属纳米颗粒。
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公开(公告)号：US08388725B2
公开(公告)日：2013-03-05
申请号：US12850276
申请日：2010-08-04
申请人： Young-Il Lee , Jae-Woo Joung , Byung-Ho Jun , Joon-Rak Choi , Kwi-Jong Lee
发明人： Young-Il Lee , Jae-Woo Joung , Byung-Ho Jun , Joon-Rak Choi , Kwi-Jong Lee
IPC分类号： B22F9/24
CPC分类号： B22F9/24 , B22F2998/00 , Y10S977/896 , B22F1/0018 , B22F3/003
摘要： The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.
摘要翻译： 本发明涉及一种制造金属纳米颗粒的装置和方法，更具体地涉及一种装置，包括：提供金属纳米颗粒的前体溶液的前体供应部分; 与前体供给部连接的第一加热部包括直径为1〜50mm的反应器通道，并被加热到不产生任何粒子的温度范围; 与第一加热部连接的第二加热部包括直径为1〜50mm的反应器通道，并被加热到制造粒子的温度范围; 以及冷却器，其与第二加热部件连接并且收集和冷却在第二加热部件处产生的金属纳米颗粒，其允许连续大量生产金属纳米颗粒。
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公开(公告)号：US20100031774A1
公开(公告)日：2010-02-11
申请号：US12149709
申请日：2008-05-07
申请人： Young-Il Lee , Jae-Woo Joung , Byung-Ho Jun , Joon-Rak Choi , Kwi-Jong Lee
发明人： Young-Il Lee , Jae-Woo Joung , Byung-Ho Jun , Joon-Rak Choi , Kwi-Jong Lee
CPC分类号： B22F9/24 , B22F2998/00 , Y10S977/896 , B22F1/0018 , B22F3/003
摘要： The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.
摘要翻译： 本发明涉及一种制造金属纳米颗粒的装置和方法，更具体地涉及一种装置，包括：提供金属纳米颗粒的前体溶液的前体供应部分; 与前体供给部连接的第一加热部包括直径为1〜50mm的反应器通道，并被加热到不产生任何粒子的温度范围; 与第一加热部连接的第二加热部包括直径为1〜50mm的反应器通道，并被加热到制造粒子的温度范围; 以及冷却器，其与第二加热部件连接并且收集和冷却在第二加热部件处产生的金属纳米颗粒，其允许连续大量生产金属纳米颗粒。
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公开(公告)号：US07935170B2
公开(公告)日：2011-05-03
申请号：US11987162
申请日：2007-11-28
申请人： Byung-Ho Jun , Jae-Woo Joung , Joon-Rak Choi
发明人： Byung-Ho Jun , Jae-Woo Joung , Joon-Rak Choi
IPC分类号： B22F9/24
CPC分类号： C01G3/02 , B22F9/20 , B22F2998/00 , B82Y30/00 , C01P2004/04 , C01P2004/64 , Y10S977/896 , B22F2301/10
摘要： The present invention relates to a method for manufacturing copper-based nanoparticles, in particular, to a method for manufacturing copper-based nanoparticles, wherein the method includes producing CuO nanoparticles by mixing CuO micropowder and alkylamine in a nonpolar solvent and heating the mixture at 60-300° C.; and producing copper-based nanoparticles by mixing a capping molecule and a reducing agent with the CuO nanoparticles and heating the mixture at 60-120° C.According to the present invention, copper-based nanoparticles can be synthesized using CuO, but not requiring any inorganic reducing agent, in a high yield and a high concentration, so that it allows mass production and easy controlling to desired oxidation number of nanoparticles.
摘要翻译： 本发明涉及一种铜基纳米粒子的制造方法，特别涉及一种铜基纳米粒子的制造方法，其特征在于，该方法包括通过将CuO微粉末和烷基胺混合在非极性溶剂中并在60℃加热混合物来制备CuO纳米粒子 -300°C。 并通过将封端分子和还原剂与CuO纳米颗粒混合并在60-120℃下加热混合物来生产铜基纳米颗粒。根据本发明，可以使用CuO合成铜基纳米颗粒，但不需要任何 无机还原剂，以高产率和高浓度，使得其允许批量生产并容易控制纳米颗粒的所需氧化数。
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公开(公告)号：US20100282022A1
公开(公告)日：2010-11-11
申请号：US11987162
申请日：2007-11-28
申请人： Byung-Ho Jun , Jae-Woo Joung , Joon-Rak Choi
发明人： Byung-Ho Jun , Jae-Woo Joung , Joon-Rak Choi
IPC分类号： B22F9/18
CPC分类号： C01G3/02 , B22F9/20 , B22F2998/00 , B82Y30/00 , C01P2004/04 , C01P2004/64 , Y10S977/896 , B22F2301/10
摘要： The present invention relates to a method for manufacturing copper-based nanoparticles, in particular, to a method for manufacturing copper-based nanoparticles, wherein the method includes producing CuO nanoparticles by mixing CuO micropowder and alkylamine in a nonpolar solvent and heating the mixture at 60-300° C.; and producing copper-based nanoparticles by mixing a capping molecule and a reducing agent with the CuO nanoparticles and heating the mixture at 60-120° C.According to the present invention, copper-based nanoparticles can be synthesized using CuO, but not requiring any inorganic reducing agent, in a high yield and a high concentration, so that it allows mass production and easy controlling to desired oxidation number of nanoparticles.
摘要翻译： 本发明涉及一种铜基纳米粒子的制造方法，特别涉及一种铜基纳米粒子的制造方法，其特征在于，该方法包括通过将CuO微粉末和烷基胺混合在非极性溶剂中并在60℃加热混合物来制备CuO纳米粒子 -300°C。 并通过将封端分子和还原剂与CuO纳米颗粒混合并在60-120℃下加热混合物来生产铜基纳米颗粒。根据本发明，可以使用CuO合成铜基纳米颗粒，但不需要任何 无机还原剂，以高产率和高浓度，使得其允许批量生产并容易控制纳米颗粒的所需氧化数。
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公开(公告)号：US07648654B2
公开(公告)日：2010-01-19
申请号：US12149423
申请日：2008-05-01
申请人： Kwi-Jong Lee , Dong-Hoon Kim , Joon-Rak Choi , Jaewoo Joung
发明人： Kwi-Jong Lee , Dong-Hoon Kim , Joon-Rak Choi , Jaewoo Joung
CPC分类号： H01B1/22 , C09D11/36 , C09D11/52 , H05K1/095 , H05K2201/0257
摘要： The present invention relates to a non-aqueous conductive nanoink composition including 20 to 85 parts by weight of metal nanoparticles which is chosen from silver, copper, nickel, platinum, palladium, and gold; 0.5 to 10 parts by weight of a polymer having an anhydride group; 15 to 80 parts by weight of a non-aqueous organic solvent.The non-aqueous conductive nanoink composition of the present invention prevents cracks during the drying process, increases the adhesion between wiring and substrate, and allows forming conductive wirings and films without cracks and delamination on the substrate such as polymer including polyimide and glass or silicon wafer.
摘要翻译： 本发明涉及包含20至85重量份选自银，铜，镍，铂，钯和金的金属纳米颗粒的非水导电纳米材料组合物; 0.5〜10重量份具有酸酐基团的聚合物; 15〜80重量份的非水有机溶剂。 本发明的非水导电性纳米材料组合物在干燥过程中防止裂纹，增加了布线与基板之间的粘附性，并且允许形成导电布线和膜，而不会在包括聚酰亚胺和玻璃或硅晶片的聚合物等基板上产生裂纹和分层 。
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