发明授权
- 专利标题： Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof
- 专利标题（中）： 具有透明封装的集成电路封装系统及其制造方法
-
申请号： US13071760申请日： 2011-03-25
-
公开(公告)号： US08399306B2公开(公告)日： 2013-03-19
- 发明人: JunMo Koo , Pandi Chelvam Marimuthu , Jae Hun Ku , Jose Alvin Caparas , Shariff Dzafir
- 申请人： JunMo Koo , Pandi Chelvam Marimuthu , Jae Hun Ku , Jose Alvin Caparas , Shariff Dzafir
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.
公开/授权文献
信息查询
IPC分类:
