Invention Grant
- Patent Title: Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof
- Patent Title (中): 具有透明封装的集成电路封装系统及其制造方法
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Application No.: US13071760Application Date: 2011-03-25
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Publication No.: US08399306B2Publication Date: 2013-03-19
- Inventor: JunMo Koo , Pandi Chelvam Marimuthu , Jae Hun Ku , Jose Alvin Caparas , Shariff Dzafir
- Applicant: JunMo Koo , Pandi Chelvam Marimuthu , Jae Hun Ku , Jose Alvin Caparas , Shariff Dzafir
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.
Public/Granted literature
- US20120241927A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSPARENT ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2012-09-27
Information query
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