公开(公告)号：US20120241927A1

公开(公告)日：2012-09-27

申请号：US13071760

申请日：2011-03-25

申请人： JunMo Koo ,  Pandi Chelvam Marimuthu ,  Jae Hun Ku ,  Jose Alvin Caparas ,  Shariff Dzafir

发明人： JunMo Koo ,  Pandi Chelvam Marimuthu ,  Jae Hun Ku ,  Jose Alvin Caparas ,  Shariff Dzafir

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在其上形成具有再分布线的基板; 将集成电路安装到基板上; 以及在覆盖集成电路的衬底和通过透明封装看到的再分配线和集成电路上模制透明封装。

公开(公告)号：US08399306B2

公开(公告)日：2013-03-19

申请号：US13071760

申请日：2011-03-25

申请人： JunMo Koo ,  Pandi Chelvam Marimuthu ,  Jae Hun Ku ,  Jose Alvin Caparas ,  Shariff Dzafir

发明人： JunMo Koo ,  Pandi Chelvam Marimuthu ,  Jae Hun Ku ,  Jose Alvin Caparas ,  Shariff Dzafir

IPC分类号： H01L21/00

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在其上形成具有再分布线的基板; 将集成电路安装到基板上; 以及在覆盖集成电路的衬底和通过透明封装看到的再分配线和集成电路上模制透明封装。