Invention Grant
- Patent Title: Flux composition and method of soldering
- Patent Title (中): 焊剂组成和焊接方法
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Application No.: US13250007Application Date: 2011-09-30
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Publication No.: US08434666B2Publication Date: 2013-05-07
- Inventor: Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
- Applicant: Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent Thomas S. Deibert
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K35/34

Abstract:
A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
Public/Granted literature
- US20130082095A1 Flux Composition And Method Of Soldering Public/Granted day:2013-04-04
Information query
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