Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US12568224Application Date: 2009-09-28
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Publication No.: US08445996B2Publication Date: 2013-05-21
- Inventor: Yong-hoon Kim , Hee-seok Lee , Yun-seok Choi
- Applicant: Yong-hoon Kim , Hee-seok Lee , Yun-seok Choi
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2008-0097785 20081006
- Main IPC: H01L23/60
- IPC: H01L23/60
Abstract:
A semiconductor package includes a main substrate, a semiconductor chip having a first side and a second side, the first side of the semiconductor chip disposed on the main substrate and electrically connected to the main substrate, and a conductive network formed on the second side of the semiconductor chip.
Public/Granted literature
- US20100013066A1 SEMICONDUCTOR PACKAGE Public/Granted day:2010-01-21
Information query
IPC分类:
