发明授权
- 专利标题： Robust FBEOL and UBM structure of C4 interconnects
- 专利标题（中）： C4互连的鲁棒FBEOL和UBM结构
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申请号： US13478076申请日： 2012-05-22
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公开(公告)号： US08450849B2公开(公告)日： 2013-05-28
- 发明人: Minhua Lu , Eric D. Pefecto , David L. Questad , Sudipta K. Ray
- 申请人： Minhua Lu , Eric D. Pefecto , David L. Questad , Sudipta K. Ray
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Robert J. Eichelburg
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/44
摘要：
An electrical conductor is connected to a first microcircuit element having a first connector site axis and a second microcircuit having a second connector site axis. The first microcircuit and the second microcircuit are separated by and operatively associated with a first electrical insulator layer. The conductor and the first microcircuit element are separated by and operatively associated with a second electrical insulator layer. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric material. The microcircuit includes a UBM and solder connection to a FBEOL via opening. Sufficiently separating the first connector site axis and the second connector site axis so they are not concentric, decouples the UBM and solder connection to the FBEOL via opening. This eliminates or minimizes electromigration and the white bump problems. A process comprises manufacturing the microcircuit.
公开/授权文献
- US20120286433A1 Robust FEBOL and UBM Structure of C4 Interconnects 公开/授权日：2012-11-15
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