公开(公告)号：US08450849B2

公开(公告)日：2013-05-28

申请号：US13478076

申请日：2012-05-22

Applicant: Minhua Lu ,  Eric D. Pefecto ,  David L. Questad ,  Sudipta K. Ray

Inventor： Minhua Lu ,  Eric D. Pefecto ,  David L. Questad ,  Sudipta K. Ray

IPC: H01L23/12 ,  H01L21/44

CPC classification number: H01L24/05 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: An electrical conductor is connected to a first microcircuit element having a first connector site axis and a second microcircuit having a second connector site axis. The first microcircuit and the second microcircuit are separated by and operatively associated with a first electrical insulator layer. The conductor and the first microcircuit element are separated by and operatively associated with a second electrical insulator layer. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric material. The microcircuit includes a UBM and solder connection to a FBEOL via opening. Sufficiently separating the first connector site axis and the second connector site axis so they are not concentric, decouples the UBM and solder connection to the FBEOL via opening. This eliminates or minimizes electromigration and the white bump problems. A process comprises manufacturing the microcircuit.

Abstract translation: 电导体连接到具有第一连接器位置轴的第一微电路元件和具有第二连接器位置轴的第二微电路。 第一微电路和第二微电路由第一电绝缘体层分离并且与第一电绝缘体层可操作地相关联。 导体和第一微电路元件由第二电绝缘体层分离并且可操作地与第二电绝缘体层相连。 第一电绝缘体层和第二电绝缘体层中的至少一个包含聚合材料。 微电路包括UBM和通过开口焊接到FBEOL的焊接。 将第一连接器位置轴和第二连接器位置轴线充分分离，使其不同心，通过打开将UBM和焊接连接断开到FBEOL。 这消除或最小化电迁移和白色凸起问题。 一种方法包括制造微电路。

公开(公告)号：US20120286433A1

公开(公告)日：2012-11-15

申请号：US13478076

申请日：2012-05-22

Applicant: Minhua Lu ,  Eric D. Pefecto ,  David L. Questad ,  Sudipta K. Ray

Inventor： Minhua Lu ,  Eric D. Pefecto ,  David L. Questad ,  Sudipta K. Ray

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L24/05 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: An electrical conductor is connected to a first microcircuit element having a first connector site axis and a second microcircuit having a second connector site axis. The first microcircuit and the second microcircuit are separated by and operatively associated with a first electrical insulator layer. The conductor and the first microcircuit element are separated by and operatively associated with a second electrical insulator layer. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric material. The microcircuit includes a UBM and solder connection to a FBEOL via opening. Sufficiently separating the first connector site axis and the second connector site axis so they are not concentric, decouples the UBM and solder connection to the FBEOL via opening. This eliminates or minimizes electromigration and the white bump problems. A process comprises manufacturing the microcircuit.

Abstract translation: 电导体连接到具有第一连接器位置轴的第一微电路元件和具有第二连接器位置轴的第二微电路。 第一微电路和第二微电路由第一电绝缘体层分离并且与第一电绝缘体层可操作地相关联。 导体和第一微电路元件由第二电绝缘体层分离并且可操作地与第二电绝缘体层相连。 第一电绝缘体层和第二电绝缘体层中的至少一个包含聚合材料。 微电路包括UBM和通过开口焊接到FBEOL的焊接。 将第一连接器位置轴和第二连接器位置轴线充分分离，使其不同心，通过打开将UBM和焊接连接断开到FBEOL。 这消除或最小化电迁移和白色凸起问题。 一种方法包括制造微电路。

公开(公告)号：US08227918B2

公开(公告)日：2012-07-24

申请号：US12560769

申请日：2009-09-16

Applicant: Minhua Lu ,  Eric D. Pefecto ,  David L. Questad ,  Sudipta K. Ray

Inventor： Minhua Lu ,  Eric D. Pefecto ,  David L. Questad ,  Sudipta K. Ray

IPC: H01L23/48

CPC classification number: H01L24/05 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A microcircuit article of manufacture comprises an electrical conductor electrically connected to both a first microcircuit element at a site comprising a first connector site having a first connector site axis and a second microcircuit element at a site comprising a second connector site having a second connector site axis. The first microcircuit element and the second microcircuit element are separated by and operatively associated with a layer comprising a first electrical insulator, whereas the conductor and the first microcircuit element are separated by and operatively associated with a layer comprising a second electrical insulator. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric electrical insulator. In another embodiment, both electrical insulator layers comprise polymeric insulator layers. The microcircuit includes a UBM and solder connection to a FBEOL via opening. Sufficiently separating the first connector site axis and the second connector site axis so they are not concentric decouples the UBM and solder connection to the FBEOL via opening to substantially eliminate or minimize inter alia, electromigration and the white bump problem typical of lead free solders employed in C4 systems. A process comprises manufacturing this type of microcircuit article.

Abstract translation: 微电路制品包括电连接到第一微电路元件的电导体，该第一微电路元件包括具有第一连接器位置轴线的第一连接器位置和位于包括具有第二连接器位置轴线的第二连接器位置的第二微电路元件 。 第一微电路元件和第二微电路元件由包括第一电绝缘体的层分离并且可操作地相关联，而导体和第一微电路元件由包括第二电绝缘体的层分开并且可操作地与包含第二电绝缘体的层相连。 第一电绝缘体层和第二电绝缘体层中的至少一个包括聚合物电绝缘体。 在另一个实施例中，两个电绝缘体层包括聚合物绝缘体层。 微电路包括UBM和通过开口焊接到FBEOL的焊接。 足够地分离第一连接器位置轴和第二连接器位置轴线，使得它们不使UBM和FBEOL通过开口的焊接连接同步解耦，以基本上消除或最小化电迁移和典型的无铅焊料的白色凸起问题 C4系统。 一种方法包括制造这种类型的微电路制品。