发明授权
US08481344B2 Methods of evaporating metal onto a semiconductor wafer in a test wafer holder
有权
在测试晶片保持器中将金属蒸发到半导体晶片上的方法
- 专利标题: Methods of evaporating metal onto a semiconductor wafer in a test wafer holder
- 专利标题(中): 在测试晶片保持器中将金属蒸发到半导体晶片上的方法
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申请号: US13179382申请日: 2011-07-08
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公开(公告)号: US08481344B2公开(公告)日: 2013-07-09
- 发明人: Lam T. Luu , Shiban K. Tiku , Richard S. Bingle , Jens A. Riege , Heather L. Knoedler , Daniel C. Weaver
- 申请人: Lam T. Luu , Shiban K. Tiku , Richard S. Bingle , Jens A. Riege , Heather L. Knoedler , Daniel C. Weaver
- 申请人地址: US MA Woburn
- 专利权人: Skyworks Solutions, Inc.
- 当前专利权人: Skyworks Solutions, Inc.
- 当前专利权人地址: US MA Woburn
- 代理机构: Knobbe, Martens, Olson & Bear, LLP
- 主分类号: H01L21/687
- IPC分类号: H01L21/687 ; C23C14/54
摘要:
Apparatus and methods for evaporating metal onto semiconductor wafers are disclosed. One such apparatus can include an evaporation chamber that includes a wafer holder, such as a dome, and a test wafer holder that is separate and spaced apart from the wafer holder. In certain implementations, the test wafer can be coupled to a cross beam supporting at least one shaper. A metal can be evaporated onto production wafers positioned in the wafer holder while metal is evaporated on a test wafer positioned in a test wafer holder. In some instances, the production wafers can be GaAs wafers. The test wafer can be used to make a quality assessment about the production wafers.
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