发明授权
- 专利标题: Semiconductor structure and manufacturing method for the same
- 专利标题(中): 半导体结构及制造方法相同
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申请号: US13101486申请日: 2011-05-05
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公开(公告)号: US08482059B2公开(公告)日: 2013-07-09
- 发明人: Chen-Yuan Lin , Cheng-Chi Lin , Shih-Chin Lien , Shyi-Yuan Wu
- 申请人: Chen-Yuan Lin , Cheng-Chi Lin , Shih-Chin Lien , Shyi-Yuan Wu
- 申请人地址: TW Hsinchu
- 专利权人: Macronix International Co., Ltd.
- 当前专利权人: Macronix International Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: McClure, Qualey & Rodack, LLP
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119
摘要:
A semiconductor structure and a manufacturing method for the same are provided. The semiconductor structure includes a first doped well, a first doped electrode, a second doped electrode, doped strips and a doped top region. The doped strips are on the first doped well between the first doped electrode and the second doped electrode. The doped strips are separated from each other. The doped top region is on the doped strips and extended on the first doped well between the doped strips. The first doped well and the doped top region have a first conductivity type. The doped strips have a second conductivity type opposite to the first conductivity type.
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