发明授权
US08482308B2 Connecting unit to test semiconductor chips and apparatus to test semiconductor chips having the same
有权
连接单元以测试半导体芯片和设备以测试具有相同的半导体芯片
- 专利标题: Connecting unit to test semiconductor chips and apparatus to test semiconductor chips having the same
- 专利标题(中): 连接单元以测试半导体芯片和设备以测试具有相同的半导体芯片
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申请号: US12614504申请日: 2009-11-09
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公开(公告)号: US08482308B2公开(公告)日: 2013-07-09
- 发明人: Ki-Jae Song , Hun-Kyo Seo , Jae-Il Lee , Jong-Won Han , Jong-Pil Park
- 申请人: Ki-Jae Song , Hun-Kyo Seo , Jae-Il Lee , Jong-Won Han , Jong-Pil Park
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd
- 当前专利权人: Samsung Electronics Co., Ltd
- 当前专利权人地址: KR Suwon-si
- 代理机构: Stanzione & Kim, LLP
- 优先权: KR10-2008-0110594 20081107
- 主分类号: G01R31/00
- IPC分类号: G01R31/00 ; G01R31/28
摘要:
A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.
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