MEMORY SYSTEM, MEMORY TEST SYSTEM AND METHOD OF TESTING MEMORY SYSTEM AND MEMORY TEST SYSTEM
    1.
    发明申请
    MEMORY SYSTEM, MEMORY TEST SYSTEM AND METHOD OF TESTING MEMORY SYSTEM AND MEMORY TEST SYSTEM 有权
    存储器系统,存储器测试系统和测试存储器系统和存储器测试系统的方法

    公开(公告)号:US20100194399A1

    公开(公告)日:2010-08-05

    申请号:US12690656

    申请日:2010-01-20

    IPC分类号: G01R31/00 G01R31/26

    摘要: A memory test system is disclosed. The memory system includes a memory device, a tester generating a clock signal and a test signal for testing the memory device, and an optical splitting module. The optical splitting module comprises an electrical-optical signal converting unit which converts each of the clock signal and the test signal into an optical signal to output the clock signal and the test signal as an optical clock signal and an optical test signal. The optical splitting unit further comprises an optical signal splitting unit which splits each of the optical clock signal and the optical test signal into n signals (n being at least two), and an optical-electrical signal converting unit which receives the split optical clock signal and the split optical test signal to convert the split optical clock signal and the split optical test signal into electrical signals used in the memory device.

    摘要翻译: 记录测试系统被公开。 存储器系统包括存储器件,产生时钟信号的测试器和用于测试存储器件的测试信号,以及光分离模块。 光分路模块包括电光信号转换单元,其将时钟信号和测试信号中的每一个转换为光信号,以输出时钟信号和测试信号作为光时钟信号和光测试信号。 光分路单元还包括光信号分离单元,其将每个光时钟信号和光测试信号分解为n个信号(n至少为2个);以及光电信号转换单元,其接收分离的光时钟信号 以及分离的光学测试信号,以将分离的光时钟信号和分割的光学测试信号转换成在存储器件中使用的电信号。

    Connecting unit to test semiconductor chips and apparatus to test semiconductor chips having the same
    2.
    发明授权
    Connecting unit to test semiconductor chips and apparatus to test semiconductor chips having the same 有权
    连接单元以测试半导体芯片和设备以测试具有相同的半导体芯片

    公开(公告)号:US08482308B2

    公开(公告)日:2013-07-09

    申请号:US12614504

    申请日:2009-11-09

    IPC分类号: G01R31/00 G01R31/28

    CPC分类号: G01R31/2886 G01R1/0408

    摘要: A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.

    摘要翻译: 用于测试半导体芯片的连接单元和用于测试具有该连接器的半导体芯片的装置包括多个连接器,其上具有一定形式的电连接端子的半导体芯片具有多个孔,电缆被配置为电连接 电连接端子到外部,以及耦合单元,其被配置成选择性地将电缆电连接到电连接端子上。 因此,可以对具有各种电连接端子的图案的半导体芯片进行电气测试,并且一次接收托盘中的半导体芯片。

    METHOD OF TESTING AN OBJECT AND APPARATUS FOR PERFORMING THE SAME
    3.
    发明申请
    METHOD OF TESTING AN OBJECT AND APPARATUS FOR PERFORMING THE SAME 审中-公开
    测试对象的方法和执行该对象的设备

    公开(公告)号:US20120150478A1

    公开(公告)日:2012-06-14

    申请号:US13325154

    申请日:2011-12-14

    IPC分类号: G06F19/00 H01L21/66 G01R31/26

    摘要: In a method of testing an object, a first test pattern for testing a first device in the object may be set in a tester. A second test pattern for testing a second device in the object may be set in a test head electrically connected between the tester and the object. The first test pattern may be provided to the first device through the test head and the second test pattern may be provided to the second device by the test head to simultaneously test the first device and the second device. Thus, the first device and the second device different from each other may be simultaneously tested without changing test conditions in the tester, so that a time for testing the object may be reduced.

    摘要翻译: 在测试对象的方法中,可以在测试器中设置用于测试对象中的第一设备的第一测试模式。 用于测试物体中的第二装置的第二测试图案可以设置在电连接在测试器和物体之间的测试头中。 可以通过测试头将第一测试图案提供给第一设备,并且可以由测试头将第二测试图案提供给第二设备,以同时测试第一设备和第二设备。 因此,可以在不改变测试器中的测试条件的情况下同时测试彼此不同的第一设备和第二设备,从而可以减少测试对象的时间。

    SEMICONDUCTOR DEVICE AND TEST APPARATUS INCLUDING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND TEST APPARATUS INCLUDING THE SAME 有权
    半导体器件和测试装置,包括它们

    公开(公告)号:US20110227593A1

    公开(公告)日:2011-09-22

    申请号:US13049349

    申请日:2011-03-16

    IPC分类号: G01R31/36 H03L7/00

    摘要: A semiconductor device and a test apparatus including the same, the semiconductor device including a command distributor receiving a serial command that is synchronized with a first clock signal and converting the serial command into a parallel command, a command decoder receiving the parallel command and generating a pattern sequence based on the parallel command, and a signal generator receiving the pattern sequence and generating operating signals synchronized with a second clock signal, wherein a frequency of the first clock signal is less than a frequency of the second clock signal.

    摘要翻译: 一种半导体器件和包括该半导体器件的测试装置,所述半导体器件包括接收与第一时钟信号同步的串行命令并将串行命令转换成并行命令的命令分配器,接收并行命令的命令解码器, 基于并行命令的模式序列,以及接收所述模式序列并生成与第二时钟信号同步的操作信号的信号发生器,其中所述第一时钟信号的频率小于所述第二时钟信号的频率。

    CONNECTING UNIT TO TEST SEMICONDUCTOR CHIPS AND APPARATUS TO TEST SEMICONDUCTOR CHIPS HAVING THE SAME
    6.
    发明申请
    CONNECTING UNIT TO TEST SEMICONDUCTOR CHIPS AND APPARATUS TO TEST SEMICONDUCTOR CHIPS HAVING THE SAME 有权
    连接单元到测试半导体芯片和测试具有相同测试半导体芯片的设备

    公开(公告)号:US20100117670A1

    公开(公告)日:2010-05-13

    申请号:US12614504

    申请日:2009-11-09

    IPC分类号: G01R31/02 G01R31/26 G01R1/06

    CPC分类号: G01R31/2886 G01R1/0408

    摘要: A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.

    摘要翻译: 用于测试半导体芯片的连接单元和用于测试具有该连接器的半导体芯片的装置包括多个连接器,其上具有一定形式的电连接端子的半导体芯片具有多个孔,电缆被配置为电连接 电连接端子到外部,以及耦合单元,其被配置成选择性地将电缆电连接到电连接端子上。 因此,可以对具有各种电连接端子的图案的半导体芯片进行电气测试,并且一次接收托盘中的半导体芯片。

    Test system to test multi-chip package compensating a signal distortion
    7.
    发明授权
    Test system to test multi-chip package compensating a signal distortion 有权
    测试系统测试多芯片封装补偿信号失真

    公开(公告)号:US07671617B2

    公开(公告)日:2010-03-02

    申请号:US11983110

    申请日:2007-11-07

    申请人: Ki-Jae Song

    发明人: Ki-Jae Song

    IPC分类号: G01R31/26

    摘要: A test system includes: a tester; and a test board, on which a multi-chip package including plural memories is mounted, being connected to the tester by way of a transmission line. The transmission line includes a compensation unit for compensating signal distortion.

    摘要翻译: 测试系统包括:测试仪; 并且其上安装有包括多个存储器的多芯片封装的测试板通过传输线连接到测试器。 传输线包括用于补偿信号失真的补偿单元。

    Printed circuit board having impedance-matched strip transmission line
    8.
    发明申请
    Printed circuit board having impedance-matched strip transmission line 有权
    具有阻抗匹配条形传输线的印刷电路板

    公开(公告)号:US20090009261A1

    公开(公告)日:2009-01-08

    申请号:US12217315

    申请日:2008-07-03

    申请人: Ki-Jae Song

    发明人: Ki-Jae Song

    IPC分类号: H01P5/12

    摘要: A printed circuit board (PCB) including an impedance-matched strip transmission line includes a strip transmission line including a main line and at least one pair of branch lines branching off from the main line. An upper ground layer is disposed over the strip transmission line and has upper opening parts corresponding in position to the branch lines. A lower ground layer is disposed under the strip transmission line and has lower opening parts corresponding in position to the branch lines. The upper and lower opening parts are symmetric about the branch lines of the strip transmission line.

    摘要翻译: 包括阻抗匹配条形传输线的印刷电路板(PCB)包括带状传输线,其包括主线和从主线分支的至少一对分支线。 上部接地层设置在带状传输线上方,并具有与分支线对应的上部开口部分。 较低的接地层设置在带状传输线下方,并且具有对应于分支线位置的较低开口部分。 上开口部分和下开口部分关于条带传输线的分支线是对称的。

    Test system improving signal integrity by restraining wave reflection
    9.
    发明申请
    Test system improving signal integrity by restraining wave reflection 审中-公开
    测试系统通过抑制波反射来提高信号完整性

    公开(公告)号:US20080109689A1

    公开(公告)日:2008-05-08

    申请号:US11974543

    申请日:2007-10-15

    申请人: Ki-Jae Song

    发明人: Ki-Jae Song

    IPC分类号: G11C29/00

    摘要: A test system that tests a plurality of memories comprises a tester, a test board coupled to the tester, and a transmission line. The test board includes the plurality of memories. A transmission line connects the memories to each other in parallel. The test board includes a compensating unit that compensates for signal distortion on the transmission line.

    摘要翻译: 测试多个存储器的测试系统包括测试器,耦合到测试器的测试板和传输线。 测试板包括多个存储器。 传输线将存储器彼此并联连接。 测试板包括补偿传输线上的信号失真的补偿单元。

    TEST BOARD, TEST EQUIPMENT, TEST SYSTEM, AND TEST METHOD
    10.
    发明申请
    TEST BOARD, TEST EQUIPMENT, TEST SYSTEM, AND TEST METHOD 审中-公开
    测试板,测试设备,测试系统和测试方法

    公开(公告)号:US20170023638A1

    公开(公告)日:2017-01-26

    申请号:US15089605

    申请日:2016-04-04

    IPC分类号: G01R31/28 G01R31/26

    CPC分类号: G01R31/2889 G01R31/31926

    摘要: A test interface board includes an encoder, a signal copier, and a decoder. The encoder digitally encodes test data to generate a modulation signal. The signal copier copies the modulation signal by inductively coupling the modulation signal and outputs at least one copy signal corresponding to the modulation signal. The decoder decodes the modulation signal and the at least one copy signal in order to test at least two semiconductor devices.

    摘要翻译: 测试接口板包括编码器,信号复印机和解码器。 编码器对测试数据进行数字编码以产生调制信号。 信号复印机通过电感耦合调制信号来复制调制信号,并输出与调制信号对应的至少一个复制信号。 解码器对调制信号和至少一个复制信号进行解码,以测试至少两个半导体器件。