发明授权
US08545660B1 Bonding apparatus and method 失效
接合装置及方法

Bonding apparatus and method
摘要:
A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.
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