发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US13156352申请日: 2011-06-09
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公开(公告)号: US08698247B2公开(公告)日: 2014-04-15
- 发明人: Chih-Chung Wang , Wei-Lun Hsu , Te-Yuan Wu , Wen-Fang Lee , Ke-Feng Lin , Shan-Shi Huang , Ming-Tsung Lee
- 申请人: Chih-Chung Wang , Wei-Lun Hsu , Te-Yuan Wu , Wen-Fang Lee , Ke-Feng Lin , Shan-Shi Huang , Ming-Tsung Lee
- 申请人地址: TW Science-Based Industrial Park, Hsin-Chu
- 专利权人: United Microelectronics Corp.
- 当前专利权人: United Microelectronics Corp.
- 当前专利权人地址: TW Science-Based Industrial Park, Hsin-Chu
- 代理商 Winston Hsu; Scott Margo
- 主分类号: H01L23/62
- IPC分类号: H01L23/62
摘要:
The present invention provides a semiconductor device including a substrate, a deep well, a high-voltage well, and a doped region. The substrate and the high-voltage well have a first conductive type, and the deep well and the doped region have a second conductive type different from the first conductive type. The substrate has a high-voltage region and a low-voltage region, and the deep well is disposed in the substrate in the high-voltage region. The high-voltage well is disposed in the substrate between the high-voltage region and the low-voltage region, and the doped region is disposed in the high-voltage well. The doped region and the high-voltage well are electrically connected to a ground.
公开/授权文献
- US20120313175A1 SEMICONDUCTOR DEVICE 公开/授权日:2012-12-13
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