发明授权
- 专利标题: Intralevel conductive light shield
- 专利标题(中): Intralevel导电灯罩
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申请号: US12133379申请日: 2008-06-05
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公开(公告)号: US08709855B2公开(公告)日: 2014-04-29
- 发明人: Jeffrey P. Gambino , Zhong-Xiang He , Kevin N. Ogg , Richard J. Rassel , Robert M. Rassel
- 申请人: Jeffrey P. Gambino , Zhong-Xiang He , Kevin N. Ogg , Richard J. Rassel , Robert M. Rassel
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 Anthony J. Canale
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A conductive light shield is formed over a first dielectric layer of a via level in a metal interconnect structure. The conductive light shield is covers a floating drain of an image sensor pixel cell. A second dielectric layer is formed over the conductive light shield and at least one via extending from a top surface of the second dielectric layer to a bottom surface of the first dielectric layer is formed in the metal interconnect structure. The conductive light shield may be formed within a contact level between a top surface of a semiconductor substrate and a first metal line level, or may be formed in any metal interconnect via level between two metal line levels. The inventive image sensor pixel cell is less prone to noise due to the blockage of light over the floating drain by the conductive light shield.
公开/授权文献
- US20090305499A1 INTRALEVEL CONDUCTIVE LIGHT SHIELD 公开/授权日:2009-12-10