Invention Grant
- Patent Title: Non-planar semiconductor structure
- Patent Title (中): 非平面半导体结构
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Application No.: US13869037Application Date: 2013-04-24
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Publication No.: US08779513B2Publication Date: 2014-07-15
- Inventor: Shih-Hung Tsai , Chien-Ting Lin , Chin-Cheng Chien , Chin-Fu Lin , Chih-Chien Liu , Teng-Chun Tsai , Chun-Yuan Wu
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/78 ; H01L29/66

Abstract:
A non-planar semiconductor structure includes a substrate, at least two fin-shaped structures, at least an isolation structure, and a plurality of epitaxial layers. The fin-shaped structures are located on the substrate. The isolation structure is located between the fin-shaped structures, and the isolation structure has a nitrogen-containing layer. The epitaxial layers respectively cover a part of the fin-shaped structures and are located on the nitrogen-containing layer. A non-planar semiconductor process is also provided for forming the semiconductor structure.
Public/Granted literature
- US20130228836A1 NON-PLANAR SEMICONDUCTOR STRUCTURE Public/Granted day:2013-09-05
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