Invention Grant
- Patent Title: Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same
- Patent Title (中): 具有多个遮光层的光电子装置和具有空隙的基板通孔的芯片封装及其形成方法
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Application No.: US13560842Application Date: 2012-07-27
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Publication No.: US08785956B2Publication Date: 2014-07-22
- Inventor: Chuan-Jin Shiu , Po-Shen Lin , Yi-Ming Chang , Hui-Ching Yang , Chiung-Lin Lai
- Applicant: Chuan-Jin Shiu , Po-Shen Lin , Yi-Ming Chang , Hui-Ching Yang , Chiung-Lin Lai
- Agency: Liu & Liu
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00 ; H01L33/52 ; H01L27/146 ; H01L23/00
Abstract:
An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer.
Public/Granted literature
- US20130026523A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2013-01-31
Information query
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