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    CHIP PACKAGE AND FABRICATION METHOD THEREOF
    3.
    发明申请
    CHIP PACKAGE AND FABRICATION METHOD THEREOF 有权
    芯片包装及其制造方法

    公开(公告)号：US20130020700A1

    公开(公告)日：2013-01-24

    申请号：US13554499

    申请日：2012-07-20

    申请人： Tsang-Yu LIU ,  Yi-Ming CHANG ,  Tzu-Min CHEN

    发明人： Tsang-Yu LIU ,  Yi-Ming CHANG ,  Tzu-Min CHEN

    IPC分类号： H01L21/50 ,  H01L23/498

    CPC分类号： H01L23/481 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3114 ,  H01L23/585 ,  H01L24/05 ,  H01L24/13 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13022 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/16235 ,  H01L2924/00

    摘要： An embodiment of the present invention relates to a chip package and fabrication method thereof, which includes a semiconductor substrate containing a chip area and a peripheral pad area surrounding the chip area, wherein a conductive pad and a through hole exposing the conductive pad are formed in the peripheral pad area; a protection layer covering a bottom surface of the semiconductor substrate and the through hole; a packaging layer formed on an upper surface of the semiconductor substrate; and a spacing layer formed between the packaging layer and the semiconductor substrate, wherein the chip packaging has a main side surface constituted of side surfaces of the semiconductor substrate, the protecting layer, the packaging layer and the spacing layer, and wherein the main side surface has at least one recess portion.

    摘要翻译： 本发明的一个实施例涉及一种芯片封装及其制造方法，该芯片封装及其制造方法包括：包含芯片区域的半导体衬底和围绕芯片区域的外围焊盘区域，其中形成导电焊盘和暴露导电焊盘的通孔 外围垫区域; 覆盖半导体衬底的底表面和通孔的保护层; 形成在所述半导体衬底的上表面上的封装层; 以及形成在所述封装层和所述半导体基板之间的间隔层，其中所述芯片封装具有由所述半导体基板，所述保护层，所述封装层和所述间隔层的侧面构成的主侧面，并且其中所述主侧面 具有至少一个凹部。

    FASTENING MECHANISM
    4.
    发明申请
    FASTENING MECHANISM 审中-公开
    快速机制

    公开(公告)号：US20100212228A1

    公开(公告)日：2010-08-26

    申请号：US12424532

    申请日：2009-04-15

    申请人： Yi-Ming Chang ,  Min-Chun Chen

    发明人： Yi-Ming Chang ,  Min-Chun Chen

    IPC分类号： E05F11/24

    CPC分类号： E05B65/006 ,  E05B17/0037 ,  E05B2015/0235 ,  G06F1/1616 ,  G06F1/1679

    摘要： A fastening mechanism suitable for being assembled into a device having a housing is provided. The fastening mechanism includes a post, a latching element, at least a plunger assembly, and an operating element. The latching element has at least an opening, the plunger assembly is disposed at a side of the latching element, and the operating element is in contact with the latching element. The post passes through the opening and presses against the plunger assembly and the post is confined by the latching element when the operating element is in a locking position. The operating element drives the latching element to move horizontally relative to the latching element so as to release the post from confinement and the plunger assembly moves vertically relative to the latching element so as to push the post out of the opening when the operating element moves to an unlocking position.

    摘要翻译： 提供一种适于组装成具有壳体的装置的紧固机构。 紧固机构包括柱，闩锁元件，至少一个柱塞组件和操作元件。 闩锁元件具有至少一个开口，柱塞组件设置在闩锁元件的一侧，并且操作元件与闩锁元件接触。 柱通过开口并压靠在柱塞组件上，当操作元件处于锁定位置时，该柱由锁定元件限制。 操作元件驱动闩锁元件相对于闩锁元件水平移动，以便将柱塞从限制释放，并且柱塞组件相对于闩锁元件垂直移动，以便当操作元件移动到 解锁位置

    ELECTRONIC DEVICE
    5.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20100142166A1

    公开(公告)日：2010-06-10

    申请号：US12368963

    申请日：2009-02-10

    申请人： Yi-Ming Chang ,  Yung-Chih Kuo ,  Chung-Teng Wu

    发明人： Yi-Ming Chang ,  Yung-Chih Kuo ,  Chung-Teng Wu

    IPC分类号： H05K5/00

    CPC分类号： G06F1/1656 ,  G06F1/1616

    摘要： An electronic device including a housing, a circuit board, a first non-metal conductive cushion and a fastening element is provided. The circuit board is disposed in the housing. The first non-metal conductive cushion is disposed between the circuit board and the housing. A potential of the first non-metal conductive cushion is equal to a potential of the housing. The fastening element fastens the circuit board and the non-metal conductive cushion to the housing.

    摘要翻译： 提供了一种包括壳体，电路板，第一非金属导电衬垫和紧固元件的电子设备。 电路板设置在壳体中。 第一非金属导电衬垫设置在电路板和壳体之间。 第一非金属导电垫的电位等于壳体的电位。 紧固元件将电路板和非金属导电垫紧固到壳体。

    Method and structure for a wafer level packaging
    6.
    发明申请
    Method and structure for a wafer level packaging 有权
    晶圆级封装的方法和结构

    公开(公告)号：US20050077605A1

    公开(公告)日：2005-04-14

    申请号：US10986104

    申请日：2004-11-12

    申请人： Dylan Yu ,  Gary Guan ,  Jolas Chen ,  Yi-Ming Chang

    发明人： Dylan Yu ,  Gary Guan ,  Jolas Chen ,  Yi-Ming Chang

    IPC分类号： G02F1/13 ,  H01L21/48 ,  H01L21/50 ,  H01L23/00 ,  H01L23/02 ,  H01L23/28 ,  H01L27/14

    CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/00014

    摘要： A method and structure for a wafer level package is provided, which utilizes a plurality of spacer walls on a semiconductor wafer or a transparent substrate, which has the ability to decide the position of the sealant. As a result, the dimension of a device is decided by the position of the sealant and the spacer walls, therefore, shrinking the distance between the photosensitive zone and the sealant will enhance the gross dies after performing a die sawing process to the whole semiconductor wafer. In addition, the semiconductor process decides the height of the spacer walls so that the yield will be improved due to the fact that a uniformity of the gap, which is between the semiconductor wafer and the transparent substrate, and the width of sealant, will be controlled.

    摘要翻译： 提供了一种用于晶片级封装的方法和结构，其利用半导体晶片或透明基板上的多个间隔壁，其具有决定密封剂位置的能力。 结果，装置的尺寸由密封剂和间隔壁的位置决定，因此，在对整个半导体晶片进行模切工艺之后，缩小感光区和密封剂之间的距离将增加总模量 。 此外，半导体工艺决定间隔壁的高度，从而由于半导体晶片和透明基板之间的间隙的均匀性和密封剂的宽度将是 受控。

    Desiccating container
    7.
    发明授权
    Desiccating container 有权
    干燥容器

    公开(公告)号：US08919545B2

    公开(公告)日：2014-12-30

    申请号：US13152688

    申请日：2011-06-03

    申请人： Yi Ming Chang

    发明人： Yi Ming Chang

    IPC分类号： B65D81/26 ,  F17C11/00 ,  B65D43/16 ,  B65D51/24 ,  B65D77/04

    CPC分类号： B65D81/266 ,  B65D43/162 ,  B65D51/245 ,  B65D77/0493 ,  B65D2543/00092 ,  B65D2543/00296 ,  B65D2543/00537 ,  B65D2543/00629 ,  B65D2543/00685 ,  B65D2543/00842

    摘要： A desiccating container is provided in the present invention. The desiccating container includes an outer can having a cap; a first inner can having an outer side and configured in the outer can, wherein there is a gap provided between the outer can and the first inner can; and a second inner can circularly configured in the outer side and in the gap, and dividing the gap into an inner gap and an outer gap, wherein the first inner can is one of an insert and a desiccating element, and the second inner can is the other one thereof.

    摘要翻译： 在本发明中提供了一种干燥容器。 干燥容器包括具有盖的外罐; 第一内罐具有外侧并构造在外罐中，其中在外罐和第一内罐之间设置有间隙; 以及第二内罐，其在外侧和间隙中圆形地配置，并且将所述间隙分成内部间隙和外部间隙，其中所述第一内部罐是插入件和干燥元件中的一个，并且所述第二内部罐 另一个。

    Illumination Device and Operating Method Thereof and Electronic Apparatus Having the Same
    9.
    发明申请
    Illumination Device and Operating Method Thereof and Electronic Apparatus Having the Same 有权
    照明装置及其操作方法及具有相同功能的电子设备

    公开(公告)号：US20100214773A1

    公开(公告)日：2010-08-26

    申请号：US12472708

    申请日：2009-05-27

    申请人： Kuo-Lun Kao ,  Yi Ming Chang ,  Chung-Teng Wu

    发明人： Kuo-Lun Kao ,  Yi Ming Chang ,  Chung-Teng Wu

    IPC分类号： F21V33/00

    CPC分类号： F21V33/0056 ,  F21S8/028 ,  F21Y2115/10 ,  G06F1/1616 ,  G06F1/1656

    摘要： An electronic apparatus includes an input device and an illumination device. The illumination device includes a chassis, an illumination module and a positioning mechanism. The module is pivotally connected to the chassis to be rotatable between a closed and an open position. The positioning mechanism is use for respectively positioning the illumination module in the closed and the open position. An operating method of the illumination device includes the following steps. First, a push force is applied to the module in the closed position. Then the module rotates from the closed position to the open position. The module enters a light-on state as arrived in the open position for illuminating the input device. Next, another push force is applied to the module in the open position, so that the module rotates to the closed position. The module enters a light-off state as arrived in the closed position.

    摘要翻译： 电子设备包括输入设备和照明设备。 照明装置包括底盘，照明模块和定位机构。 模块可枢转地连接到底盘，以在闭合位置和打开位置之间旋转。 定位机构用于将照明模块分别定位在关闭位置和打开位置。 照明装置的操作方法包括以下步骤。 首先，在关闭位置对模块施加推力。 然后模块从关闭位置旋转到打开位置。 模块进入到达打开位置的点亮状态，用于照亮输入设备。 接下来，在打开位置将另一个推力施加到模块，使得模块旋转到关闭位置。 模块进入关闭状态，到达关闭位置。

    METHOD OF MANUFACTURING A LIQUID CRYSTAL ALIGNMENT FILM UTILIZING LONG-THROW SPUTTERING
    10.
    发明申请
    METHOD OF MANUFACTURING A LIQUID CRYSTAL ALIGNMENT FILM UTILIZING LONG-THROW SPUTTERING 审中-公开
    使用长时间喷溅的液晶对准膜的制造方法

    公开(公告)号：US20060272938A1

    公开(公告)日：2006-12-07

    申请号：US10908916

    申请日：2005-06-01

    申请人： Ta-Shuang Kuan ,  Yi-Ming Chang ,  Chia-Te Lin ,  Chia-Tsung Chan

    发明人： Ta-Shuang Kuan ,  Yi-Ming Chang ,  Chia-Te Lin ,  Chia-Tsung Chan

    IPC分类号： C23C14/00

    CPC分类号： C23C14/34 ,  C23C14/225

    摘要： The present invention provides a method of manufacturing an LC alignment film utilizing long-throw sputtering. The method includes putting a substrate on a substrate carrier in a chamber, utilizing high-density plasma to bombard a target over the substrate to produce sputtering species, and providing a bias voltage in the chamber. Nearly vertical directional sputtering species are deposited on the surface of the substrate to form an LC alignment film. The distance between the target and the substrate is more than 20 cm.

    摘要翻译： 本发明提供利用长投射溅射制造LC取向膜的方法。 该方法包括将衬底放置在室中的衬底载体上，利用高密度等离子体在衬底上轰击靶以产生溅射物质，并在腔室中提供偏置电压。 几乎垂直的定向溅射物质沉积在衬底的表面上以形成LC取向膜。 靶和基片之间的距离大于20厘米。