公开(公告)号：US08785956B2

公开(公告)日：2014-07-22

申请号：US13560842

申请日：2012-07-27

申请人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Yi-Ming Chang ,  Hui-Ching Yang ,  Chiung-Lin Lai

发明人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Yi-Ming Chang ,  Hui-Ching Yang ,  Chiung-Lin Lai

IPC分类号： H01L33/00 ,  H01L21/00 ,  H01L33/52 ,  H01L27/146 ,  H01L23/00

CPC分类号： H01L27/14623 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14687 ,  H01L27/1469 ,  H01L33/52 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer.

摘要翻译： 本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的光电子器件; 设置在所述基板上的导电层，其中所述导电层电连接到所述光电子器件; 设置在所述基板和所述导电层之间的绝缘层; 设置在所述基板的第二表面上的第一遮光层; 以及第二遮光层，其设置在所述第一遮光层上并与所述第一遮光层直接接触，其中所述第一遮光层和所述第二遮光层之间的接触界面。

公开(公告)号：US20130026523A1

公开(公告)日：2013-01-31

申请号：US13560842

申请日：2012-07-27

申请人： Chuan-Jin SHIU ,  Po-Shen LIN ,  Yi-Ming CHANG ,  Hui-Ching YANG ,  Chiung-Lin LAI

发明人： Chuan-Jin SHIU ,  Po-Shen LIN ,  Yi-Ming CHANG ,  Hui-Ching YANG ,  Chiung-Lin LAI

IPC分类号： H01L33/52 ,  H01L31/0216

CPC分类号： H01L27/14623 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14687 ,  H01L27/1469 ,  H01L33/52 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer.

摘要翻译： 本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的光电子器件; 设置在所述基板上的导电层，其中所述导电层电连接到所述光电子器件; 设置在所述基板和所述导电层之间的绝缘层; 设置在所述基板的第二表面上的第一遮光层; 以及第二遮光层，其设置在所述第一遮光层上并与所述第一遮光层直接接触，其中所述第一遮光层和所述第二遮光层之间的接触界面。