发明授权
- 专利标题: High electron mobility transistors and methods of manufacturing the same
- 专利标题(中): 高电子迁移率晶体管及其制造方法
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申请号: US13307769申请日: 2011-11-30
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公开(公告)号: US08796737B2公开(公告)日: 2014-08-05
- 发明人: In-jun Hwang , Jai-kwang Shin , Jae-joon Oh , Jong-bong Ha , Hyuk-soon Choi , Ki-ha Hong
- 申请人: In-jun Hwang , Jai-kwang Shin , Jae-joon Oh , Jong-bong Ha , Hyuk-soon Choi , Ki-ha Hong
- 申请人地址: KR Gyeonggi-Do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-Do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR10-2011-0043082 20110506
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L21/338
摘要:
High electron mobility transistors (HEMTs) and methods of manufacturing the same. A HEMT may include a channel layer and a channel supply layer, and the channel supply layer may be a multilayer structure. The channel supply layer may include an etch stop layer and an upper layer on the etch stop layer. A recess region may be in the upper layer. The recess region may be a region recessed to an interface between the upper layer and the etch stop layer. A gate electrode may be on the recess region.
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