发明授权
- 专利标题: Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
- 专利标题(中): 铜导体膜及其制造方法,导电性基板及其制造方法,铜导体布线及其制造方法以及处理液
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申请号: US12808768申请日: 2008-12-17
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公开(公告)号: US08801971B2公开(公告)日: 2014-08-12
- 发明人: Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
- 申请人: Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2007-325863 20071218; JP2008-062964 20080312; JP2008-062966 20080312; JP2008-097349 20080403
- 国际申请: PCT/JP2008/073006 WO 20081217
- 国际公布: WO2009/078448 WO 20090625
- 主分类号: H01B1/00
- IPC分类号: H01B1/00 ; H01B1/12 ; C22C9/00 ; C21B11/10 ; B05D5/12 ; B28B19/00 ; B29B15/00 ; C23C18/00 ; C23C20/00 ; C23C24/00 ; C23C26/00 ; C23C28/00 ; C23C30/00 ; H01C17/06 ; H05K3/00 ; B22F3/00 ; B22F3/26 ; B22F5/00 ; B22F7/00 ; C22C28/00 ; C22C29/00 ; B32B15/20
摘要:
Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.