公开(公告)号：US20100233011A1

公开(公告)日：2010-09-16

申请号：US12739228

申请日：2008-10-20

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Youichi Machii ,  Yasushi Kumashiro ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Youichi Machii ,  Yasushi Kumashiro ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

IPC分类号： B22F7/04 ,  B22F1/02 ,  B32B15/02

CPC分类号： H05K3/102 ,  H01B1/026 ,  H01B1/22 ,  H01L21/4867 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/105 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  Y10T428/12181 ,  H01L2924/00

摘要： There are provided are a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used but copper particles, which cause little electromigration and are small in the price rate of material itself, are used to form a low-resistance copper wiring pattern while the generation of cracks therein is restrained; and a copper oxide particle dispersed slurry used therein.The method is a method for forming a copper wiring pattern including the step of using a dispersion slurry wherein copper based particles having a copper oxide surface are dispersed to form any pattern over a substrate, and the step of reducing the copper oxide surface of the copper based particles in the pattern with atomic form hydrogen to return the oxide to copper, and sintering particles of the copper metal generated by the reduction and bonding the particles to each other.

摘要翻译： 提供了一种方法，其中对现有技术中的铜颗粒进行抗氧化和分散是必需的表面处理剂几乎不被使用，但是导致电迁移少的材料和材料的价格率小的铜颗粒 本身用于形成低电阻铜布线图案，同时抑制其中的裂纹的产生; 和其中使用的氧化铜颗粒分散浆料。 该方法是一种形成铜布线图案的方法，包括使用其中分散有铜氧化物表面的铜基颗粒在基底上形成任何图案的分散浆料的步骤，以及还原铜的氧化铜表面的步骤 以原子形式形成氢以将氧化物返回到铜，以及烧结通过还原并将颗粒彼此结合而产生的铜金属的颗粒。

公开(公告)号：US08801971B2

公开(公告)日：2014-08-12

申请号：US12808768

申请日：2008-12-17

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

IPC分类号： H01B1/00 ,  H01B1/12 ,  C22C9/00 ,  C21B11/10 ,  B05D5/12 ,  B28B19/00 ,  B29B15/00 ,  C23C18/00 ,  C23C20/00 ,  C23C24/00 ,  C23C26/00 ,  C23C28/00 ,  C23C30/00 ,  H01C17/06 ,  H05K3/00 ,  B22F3/00 ,  B22F3/26 ,  B22F5/00 ,  B22F7/00 ,  C22C28/00 ,  C22C29/00 ,  B32B15/20

CPC分类号： H05K3/182 ,  C23C18/1601 ,  C23C18/1603 ,  C23C18/1633 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1824 ,  C23C18/1872 ,  C23C18/30 ,  C23C18/40 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/203 ,  H05K3/105 ,  H05K3/1241 ,  H05K2203/0315 ,  H05K2203/0709 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/12014 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/0002

摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

摘要翻译： 提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。 公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或 复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线 层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

公开(公告)号：US20120125659A1

公开(公告)日：2012-05-24

申请号：US12808768

申请日：2008-12-17

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

IPC分类号： H01B5/00 ,  C22B15/00 ,  C09K3/00 ,  B05D3/00 ,  B32B15/20 ,  C22C9/00 ,  B05D5/12

CPC分类号： H05K3/182 ,  C23C18/1601 ,  C23C18/1603 ,  C23C18/1633 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1824 ,  C23C18/1872 ,  C23C18/30 ,  C23C18/40 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/203 ,  H05K3/105 ,  H05K3/1241 ,  H05K2203/0315 ,  H05K2203/0709 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/12014 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/0002

摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

摘要翻译： 提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。 公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或 复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线 层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

公开(公告)号：US4393188A

公开(公告)日：1983-07-12

申请号：US233746

申请日：1981-02-12

申请人： Akio Takahashi ,  Motoyo Wajima ,  Ritsuro Tada ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

发明人： Akio Takahashi ,  Motoyo Wajima ,  Ritsuro Tada ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

IPC分类号： C08G73/00 ,  C08G59/40 ,  C08G59/50 ,  C08G59/56 ,  C08G73/12 ,  C08J5/24 ,  H05K1/03 ,  C08G59/06

CPC分类号： C08G73/12 ,  C08G59/4042 ,  C08G59/56 ,  C08G73/121 ,  C08J5/24 ,  H05K1/0346 ,  Y10T428/31511 ,  Y10T428/31721

摘要： A process for preparing a thermosetting maleimide type prepolymer which comprises reacting (A) a polyfunctional maleimide compound, (B) a bis-maleimide, (C) a diamine and (D) an epoxy compound. The maleimide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.

摘要翻译： 一种制备热固性马来酰亚胺型预聚物的方法，其包括使（A）多官能马来酰亚胺化合物，（B）双马来酰亚胺，（C）二胺和（D）环氧化合物反应。 根据本发明的方法制备的马来酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中具有快速固化性和优异的溶解性，可以低成本获得。 因此，预聚物有利地用于生产具有良好耐热性，低吸湿性和对诸如铜箔的各种基材的良好粘附性的层压板。

公开(公告)号：US4400438A

公开(公告)日：1983-08-23

申请号：US249242

申请日：1981-03-30

申请人： Akio Takahashi ,  Yutaka Itoh ,  Takeshi Shimazaki ,  Motoyo Wajima ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

发明人： Akio Takahashi ,  Yutaka Itoh ,  Takeshi Shimazaki ,  Motoyo Wajima ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

IPC分类号： B32B15/04 ,  B32B15/08 ,  B32B15/088 ,  B32B27/04 ,  C08J5/24 ,  C09D179/08 ,  H05K1/03 ,  B32B31/12

CPC分类号： C09D179/085 ,  B32B27/04 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2203/122 ,  Y10S428/92 ,  Y10S428/921 ,  Y10T428/31681

摘要： A process for producing a fire retardant and heat resistant copper-clad laminated board, characterized in that a maleimide resin type varnish containing a small amount of a specific halogenated diphenyl ether compound is used for impregnation of base material therewith. Copper-clad laminated boards produced according to the present invention may be so improved in fire or flame retardant properties as to be classed 94 V-0 in accordance with UL 94 (vertical burning test), and, nevertheless, are not substantially downgraded in heat resisting properties as well as copper foil peel strength.

摘要翻译： 一种阻燃和耐热铜包覆层压板的制造方法，其特征在于，使用含有少量特定的卤代二苯醚化合物的马来酰亚胺树脂型清漆浸渍基材。 根据本发明生产的覆铜层压板可以根据UL 94（垂直燃烧试验）在耐火或阻燃性能方面得到如此提高的等级为94V-0，并且在热量方面基本上不降低 耐铜性以及铜箔剥离强度。

公开(公告)号：US4346206A

公开(公告)日：1982-08-24

申请号：US176740

申请日：1980-08-11

申请人： Akio Takahashi ,  Yutaka Itoh ,  Takeshi Shimazaki ,  Motoyo Wajima ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

发明人： Akio Takahashi ,  Yutaka Itoh ,  Takeshi Shimazaki ,  Motoyo Wajima ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

IPC分类号： C08G59/00 ,  C08G59/40 ,  C08G73/00 ,  C08G73/12 ,  C08G79/08 ,  C08L63/00 ,  H05K1/03 ,  C08G73/10

CPC分类号： C08G79/08 ,  C08G59/4042 ,  C08G73/121 ,  C08L63/00 ,  H05K1/0346

摘要： A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.

摘要翻译： 一种制备热固性酰亚胺型预聚物的方法，其包括在沸点为70〜170℃的有机溶剂的存在下加热双酰亚胺（A）和二胺（B），并将反应混合物加热 与环氧化合物（C）。 根据本发明方法制备的酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中具有快速固化性和优异的溶解性，可以低成本获得。 因此，预聚物有利地用于生产具有良好耐热性，低吸湿性和对诸如铜箔的各种基材的良好粘附性的层压板。