发明授权
US08822993B2 Integrated circuit including sensor structure, related method and design structure
有权
集成电路包括传感器结构，相关方法和设计结构
- 专利标题： Integrated circuit including sensor structure, related method and design structure
- 专利标题（中）： 集成电路包括传感器结构，相关方法和设计结构
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申请号： US13550813申请日： 2012-07-17
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公开(公告)号： US08822993B2公开(公告)日： 2014-09-02
- 发明人: Edward C. Cooney, III , Jeffrey P. Gambino , Zhong-Xiang He , Tom C. Lee
- 申请人： Edward C. Cooney, III , Jeffrey P. Gambino , Zhong-Xiang He , Tom C. Lee
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Hoffman Warnick LLC
- 代理商 David A. Cain
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L21/66 ; H01L23/48 ; G01R31/28
摘要：
An Integrated Circuit (IC) and a method of making the same. In one embodiment, an integrated circuit includes: a substrate; a first metal layer disposed on the substrate and including a sensor structure configured to indicate a crack in a portion of the integrated circuit; and a second metal layer disposed proximate the first metal layer, the second metal layer including a wire component disposed proximate the sensor structure.
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