发明授权
- 专利标题: LED package with increased feature sizes
- 专利标题(中): LED封装具有增加的特征尺寸
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申请号: US12757891申请日: 2010-04-09
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公开(公告)号: US08866169B2公开(公告)日: 2014-10-21
- 发明人: David Emerson , Brian Collins , Michael Bergmann , John Edmond , Eric Tarsa , Peter Andrews , Bernd Keller , Christopher Hussell , Amber Salter
- 申请人: David Emerson , Brian Collins , Michael Bergmann , John Edmond , Eric Tarsa , Peter Andrews , Bernd Keller , Christopher Hussell , Amber Salter
- 申请人地址: US CA Goleta
- 专利权人: Cree, Inc.
- 当前专利权人: Cree, Inc.
- 当前专利权人地址: US CA Goleta
- 代理机构: Koppel, Patrick, Heybl & Philpott
- 主分类号: H01L33/48
- IPC分类号: H01L33/48 ; H01L33/62 ; H01L33/64 ; H01L33/58 ; H01L33/20 ; H01L33/54
摘要:
A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having square dimensions greater than 3.5 mm used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.
公开/授权文献
- US20100252851A1 LED PACKAGE WITH INCREASED FEATURE SIZES 公开/授权日:2010-10-07