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    Methods for packaging of a semiconductor light emitting device
    4.
    发明授权
    Methods for packaging of a semiconductor light emitting device 有权
    包装半导体发光器件的方法

    公开(公告)号：US07326583B2

    公开(公告)日：2008-02-05

    申请号：US11044779

    申请日：2005-01-27

    申请人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    IPC分类号： H01L21/00

    CPC分类号： H01L33/58 ,  H01L33/52

    摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

    摘要翻译： 将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖 并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。 反射腔中的密封材料固化。 还提供了用于其的封装的半导体发光器件和反射器。

    Uniform emission LED package
    6.
    发明申请
    Uniform emission LED package 有权
    均匀排放LED封装

    公开(公告)号：US20070228387A1

    公开(公告)日：2007-10-04

    申请号：US11398214

    申请日：2006-04-04

    申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

    摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

    摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。

    Reflector packages and methods for packaging of a semiconductor light emitting device
    7.
    发明申请
    Reflector packages and methods for packaging of a semiconductor light emitting device 有权
    用于封装半导体发光器件的反射器封装和方法

    公开(公告)号：US20050221518A1

    公开(公告)日：2005-10-06

    申请号：US11044779

    申请日：2005-01-27

    申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    IPC分类号： H01L21/00 ,  H01L33/52 ,  H01L33/58

    CPC分类号： H01L33/58 ,  H01L33/52

    摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

    摘要翻译： 将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖 并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。 反射腔中的密封材料固化。 还提供了用于其的封装的半导体发光器件和反射器。

    PACKAGED LIGHT EMITTING DEVICES
    9.
    发明申请
    PACKAGED LIGHT EMITTING DEVICES 有权
    包装发光装置

    公开(公告)号：US20070290218A1

    公开(公告)日：2007-12-20

    申请号：US11849530

    申请日：2007-09-04

    申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

    摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

    摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

    Uniform emission LED package
    10.
    发明授权
    Uniform emission LED package 有权
    均匀排放LED封装

    公开(公告)号：US08969908B2

    公开(公告)日：2015-03-03

    申请号：US11398214

    申请日：2006-04-04

    申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/48

    CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

    摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

    摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。