发明授权
- 专利标题: Yttrium and titanium high-k dielectric films
- 专利标题(中): 钇和钛高k电介质膜
-
申请号: US13677126申请日: 2012-11-14
-
公开(公告)号: US08900418B2公开(公告)日: 2014-12-02
- 发明人: Imran Hashim , Hanhong Chen , Tony Chiang , Indranil De , Nobi Fuchigami , Edward Haywood , Pragati Kumar , Sandra Malhotra , Sunil Shanker
- 申请人: Intermolecular, Inc.
- 申请人地址: US CA San Jose JP Tokyo
- 专利权人: Intermolecular, Inc.,Elpida Memory, Inc.
- 当前专利权人: Intermolecular, Inc.,Elpida Memory, Inc.
- 当前专利权人地址: US CA San Jose JP Tokyo
- 主分类号: C23C14/34
- IPC分类号: C23C14/34 ; B05D5/12 ; H01L49/02 ; C23C16/40 ; C23C16/455 ; H01L21/314 ; H01L21/316 ; H01L27/108 ; H01L21/02
摘要:
This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on yttrium and titanium, to have a high dielectric constant and low leakage characteristic and (b) related devices and structures. An oxide layer having both yttrium and titanium may be fabricated either as an amorphous oxide or as an alternating series of monolayers. In several embodiments, the oxide is characterized by a yttrium contribution to total metal that is specifically controlled. The oxide layer can be produced as the result of a reactive process, if desired, via either a PVD process or, alternatively, via an atomic layer deposition process that employs specific precursor materials to allow for a common process temperature window for both titanium and yttrium reactions.
公开/授权文献
- US20130071990A1 Yttrium and Titanium High-K Dielectric Films 公开/授权日:2013-03-21
信息查询
IPC分类: